Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Chip cleaning container on semiconductor lapping plate and use method thereof

A chip cleaning and grinding plate technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems that the chip interface cleaning process on the grinding plate cannot be performed, so as to improve batch production efficiency, facilitate loading and unloading, and prevent The effect of scratching

Active Publication Date: 2019-07-09
Shandong Huaguang Optoelectronics Co. Ltd.
View PDF10 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In the above-mentioned patent documents, the chip devices involved are only suitable for the cleaning of individual single-chip or multi-chip chips, and cannot perform the interface cleaning process of chips on the grinding board.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip cleaning container on semiconductor lapping plate and use method thereof
  • Chip cleaning container on semiconductor lapping plate and use method thereof
  • Chip cleaning container on semiconductor lapping plate and use method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] A chip cleaning container on a semiconductor grinding board, including a container body, the container body is a rectangular cavity with an open top, and ten slot units are arranged inside the container body, and a carrier platform is arranged in the slot unit, such as figure 1 shown.

[0050] The card slot unit includes a card slot front stop, a card slot back stop, and a card slot bottom stop. The number of the card slot front stop and the card slot back stop in a card slot unit is two, and the card slot front stops are arranged symmetrically on the container body. On the inner wall of the container, the back stop of the card slot is symmetrically arranged on the opposite inner wall where the front stop of the card slot is located, and the bottom stop of the card slot is arranged at the bottom of the container body. Both the front block of the card slot and the rear block of the card slot are strip-shaped rectangular blocks.

[0051] The carrier table includes the ca...

Embodiment 2

[0054] A chip cleaning container on a semiconductor grinding board, the structure of which is as described in Embodiment 1, the difference is that a container handle is provided at opposite ends of the container body. The handle of the container is arranged on the outside of the side wall of the short side of the rectangle of the container body, and the front stopper and the back stop of the card slot are arranged on the inside of the side wall of the long side of the rectangle of the container body.

Embodiment 3

[0056] A chip cleaning container on a semiconductor grinding board, the structure of which is as described in Embodiment 1, the difference is that the length of the stopper at the front stop of the card slot is shorter than the length of the stopper at the back stop of the card slot.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a chip cleaning container on a semiconductor lapping plate, and a use method thereof, and belongs to the technical field of the semiconductor chip interface cleaning treatment. The device comprises a container body with a handle, neck units and movable carrier tables; symmetric neck units in a certain cycle repetition are arranged in the container body, one carrier table is arranged in each neck unit, and a lapping plate with a ship is placed on each carrier table board; two sides of each carrier table are located in the neck unit; two sides of the carrier table move downwards along the space of the neck unit on an inner wall of the container body; one end of the outside of the carrier table is propped against the bottom of each neck unit, and the carrier tables and the lapping plates are commonly immersed into a holding cavity of the container body. The chip cleaning container not only provides lapping plates and a chip interface cleaning / corrosion process treatment container on the plate, but also provides a loading device of the lapping plate, and the cleaning corrosion treatment of the interface is guaranteed when the production efficiency is improved.

Description

technical field [0001] The invention relates to a chip cleaning container on a semiconductor grinding board and a method for using the same, belonging to the technical field of semiconductor chip interface cleaning treatment. Background technique [0002] With the continuous development of semiconductor technology, the requirements for process technology are getting higher and higher, especially for the surface quality of semiconductor chips. In the semiconductor production process, interface cleaning is required in almost every process. The quality of chip cleaning has a serious impact on device performance, and its process quality will directly affect the yield, optoelectronic performance and reliability of the device. At present, the more common cleaning technologies include: wet chemical cleaning, ultrasonic cleaning, megasonic cleaning, scrubbing, high-pressure jet valve, plasma cleaning, RCA cleaning, etc., among which wet chemical cleaning is particularly common. [...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/673
CPCH01L21/67017H01L21/673
Inventor 刘青苏建汤庆敏肖成峰郑兆河徐现刚
Owner Shandong Huaguang Optoelectronics Co. Ltd.
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com