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Exploding foil integrated chip based on low-temperature co-fired ceramic and preparation technology thereof

A technology of low-temperature co-fired ceramics and integrated chips, which is applied in blasting barrels, offensive equipment, weapon accessories, etc. It can solve the problems of low energy utilization efficiency of explosive foil detonator units, difficulty in miniaturization, and high ignition energy, and achieve energy utilization. Improve, improve product consistency, high degree of integration effect

Active Publication Date: 2019-07-02
NANJING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Manual or mechanical alignment and installation methods are prone to misalignment, which makes the energy utilization efficiency of the explosive foil detonator unit low and the effect is unreliable
In addition, the traditional explosive foil detonator unit has a large structural volume and high ignition energy, and it is difficult to achieve miniaturization

Method used

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  • Exploding foil integrated chip based on low-temperature co-fired ceramic and preparation technology thereof
  • Exploding foil integrated chip based on low-temperature co-fired ceramic and preparation technology thereof
  • Exploding foil integrated chip based on low-temperature co-fired ceramic and preparation technology thereof

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Embodiment

[0047] In this embodiment, an explosive foil detonator is designed on the basis of the explosive foil integrated chip unit. figure 1 , figure 2 , Figure 3, Figure 4 and Figure 5 The explosive foil integrated chip unit includes a ceramic substrate 1, a metal Au layer 2, a Parylene C layer 3-a, a metal W-Ti / Cu layer 3-b, an accelerating chamber 4, a charge tank 5 and an explosive column 6, In addition, it also includes the metal via 7-a, the paste 7-b in the ceramic substrate 1, the pad area 8 on the back and the Pd / Ag layer 9 to facilitate the connection with other parts. The ceramic substrate 1 is used as a backplane in the explosive foil integrated chip, and its length, width, and height are 11mm×7mm×1mm respectively. The metal Au layer 2 is placed on the ceramic substrate 1, and the thickness is 6-10μm. The metal Au layer 2 includes bridges. Area 2-a, transition area 2-b and conduction band 2-c are three parts. Bridge area 2-a is the part with the smallest cross-sectional ar...

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Abstract

The invention discloses an exploding foil integrated chip based on low-temperature co-fired ceramic and a preparation technology thereof. The exploding foil integrated chip comprises a ceramic substrate, a metal layer, a flier-plate layer, an acceleration cavity, an explosive charging groove and an explosive column and further comprises metal via holes formed in the ceramic substrate, slurry, a welding disc zone, a Pd / Ag layer and other structures capable of being connected with other parts conveniently, and the welding disc zone, the Pd / Ag layer and the other structures are arranged on the back of the ceramic substrate. The ceramic substrate serves as a reflecting backboard in the integrated chip; the metal layer comprises a bridge zone, a transition zone and a guide belt; the flier-platelayer comprises a ceramic flier plate formed by integrally sintering a ceramic belt blank, and a Parylene C / W-Ti / Cu composite flier plate; the acceleration cavity is used for providing an acceleration space for the flier plate; and the explosive charging groove is used for providing precise position for placement of the explosive column. Compared with the prior art, the exploding foil integratedchip has the advantages that through the low-temperature co-fired ceramic technique, an exploding foil exploder is higher in integration degree and smaller in size, mass production can be achieved, the product consistency is improved, and the cost is greatly reduced.

Description

Technical field [0001] The invention relates to the technical field of low-energy miniature ignition and detonation devices, in particular to a low-temperature co-fired ceramic-based explosive foil integrated chip and a preparation process thereof. Background technique [0002] The concept of Exploding Foil Initiator System (EFIs) was proposed by the Lawrence Livermore Laboratory in the United States in the 1960s. It is also called an in-line safety initiation system. Its composition includes pulsed power units and explosions. Foil initiator unit. The former mainly includes control circuits, boost modules, high-voltage capacitors, and high-voltage switches, etc., which provide the energy required for metal electric explosions for the explosive foil initiator unit, and give a firing command to turn on the loop through the high-voltage switch; the latter mainly includes The back plate, explosive foil, flying piece, accelerating chamber and insensitive charge are cut through the me...

Claims

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Application Information

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IPC IPC(8): F42B3/12F42B3/195
CPCF42B3/121F42B3/124F42B3/195
Inventor 朱朋徐聪陈楷沈瑞琪叶迎华
Owner NANJING UNIV OF SCI & TECH
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