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Ultralow-temperature high-voltage chip aluminum capacitor-used electrolyte and preparation method thereof

A high-voltage, chip-type technology, applied in the field of capacitors, can solve the problems of short-circuit, leakage current recovery, and impedance increase of chip capacitors, and achieve the effect of reducing ESR.

Active Publication Date: 2019-06-25
湖州新江浩电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the current technical difficulties in the preparation of ultra-low temperature and high voltage SMD capacitors, a new ultra-low temperature and high voltage electrolyte technology is needed to prepare ultra-low temperature and high voltage SMD capacitors, which can not only Solve the ultra-low temperature of high-voltage chip capacitors, and can solve the current technical problems of chip capacitors in the process of over-reflow soldering, such as short circuit, electrolyte leakage, leakage current recovery, and impedance increase.

Method used

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  • Ultralow-temperature high-voltage chip aluminum capacitor-used electrolyte and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] ① Heat the main solvent: 35.2% of γ-butyrolactone and 22.4% of ethylene glycol and auxiliary solvents of 8.2% of diethylene glycol monomethyl ether and 7.7% of diethylene glycol butyl ether to 85 ℃.

[0019] ② Slowly add flash fire voltage enhancer: 2.5% polypropylene alcohol and 1.5% nano-silicon dioxide and raise the temperature to 135°C for 70 minutes.

[0020] ③ Lower the temperature to 70°C and add solutes: 8.3% 2-methylammonium azelate and 3.4% 7,8-dimethyltetradecanetetracarboxylate and raise the temperature to 125°C for 40 minutes.

[0021] ④ Lower the temperature to 80°C and add 2.5% p-nitrobenzyl alcohol as a hydrogen remover, then raise the temperature to 110°C and keep it warm for 20 minutes.

[0022] ⑤ Cool down to 55°C and add 8.3% ethylene glycol, boric acid, glycerol, polyvinyl alcohol, sebacic acid, phosphoric acid and its derivatives to react at 130-165°C for 3-6 hours as a modified synthetic additive The product is completed after incubation for 30 ...

Embodiment 2

[0025] ① Heat the main solvent: 30.9% of γ-butyrolactone and 12.1% of ethylene glycol and the auxiliary solvents of 18.2% of diethylene glycol diethyl ether and 13.8% of diethylene glycol butyl ether in a reaction kettle to 85°C .

[0026] ② Slowly add flash fire voltage enhancer: 2.0% polypropylene alcohol and 1.5% high polyethylene glycol and raise the temperature to 135°C for 70 minutes.

[0027] ③ Lower the temperature to 70°C and add solutes: 8.7% ammonium 5,6-sebacate and 3.3% ammonium 1,6-dodecanedioate and heat up to 125°C for 40 minutes.

[0028] ④ Lower the temperature to 80°C and add m-nitroacetophenone with a hydrogen remover of 2.1%, and raise the temperature to 110°C for 20 minutes.

[0029] ⑤ Cool down to 55°C and add modified synthetic additives of 7.4% ethylene glycol, boric acid, glycerol, polyvinyl alcohol, sebacic acid, phosphoric acid and its derivatives and react at 130-165°C for 3-6 hours The product is completed after incubation for 30 minutes.

Embodiment 3

[0031] ① Heat the main solvent: 10.9% of diethylene glycol and 36.1% of γ-butyrolactone and the auxiliary solvent of 16.2% of diethylene glycol monomethyl ether and 9.8% of dimethyl sulfoxide to 85°C in the reaction kettle .

[0032] ② Slowly add flash fire voltage enhancer: 2.2% polyvinyl alcohol and 4.8% nano-silicon dioxide and raise the temperature to 135°C for 70 minutes.

[0033] ③ Lower the temperature to 70°C and add solutes: 9.3% ammonium 1,7-sebacate and 3.7% ammonium tridecanetricarboxylate and heat up to 125°C for 40 minutes.

[0034] ④ Lower the temperature to 80°C and add 1.8% p-nitrobenzoic acid as a hydrogen remover, then raise the temperature to 110°C and keep it warm for 20 minutes.

[0035] ⑤ Cool down to 55°C and add 5.2% modified synthetic additives of ethylene glycol, boric acid, glycerin, polyvinyl alcohol, sebacic acid, phosphoric acid and its derivatives and react at 130-165°C for 3-6 hours The product is completed after incubation for 30 minutes.

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Abstract

The invention provides an ultralow-temperature high-voltage chip aluminum capacitor-used electrolyte, which comprises 32% to 58% of a main solvent, 5% to 34% of an auxiliary solvent, 5.2% to 21.4% ofa solute, 2.5% to 8.5% of a flash fire booster, 0.7% to 2.5% of a hydrogen scavenger and 1% to 10% of a modified synthetic additive, wherein the main solvent is one or multiple selected from ethyleneglycol, diethylene glycol, triethylene glycol, ethylene carbonate, propylene carbonate, gamma-butyrolactone and the like; and the auxiliary solvent is one or multiple selected from diethylene glycol mono-methyl ether, diethyl carbitol, diethylene glycol ethyl methyl ether, diglycol dimethyl ether, triethylene glycol dimethyl ether, diethylene glycol monobutyl ether, dimethyl sulfoxide, sulfolane and the like. The ultralow-temperature high-voltage electrolyte has good negative temperature electric performance, higher stability and stronger applicability.

Description

technical field [0001] The invention relates to the technical field of capacitors, in particular to an electrolyte solution for ultra-low temperature and high voltage chip-type aluminum capacitors and a preparation method thereof. Background technique [0002] With the rapid development of aluminum electrolytic capacitors in the direction of small size, large capacity, high performance, and low cost, especially the wide application of surface mount technology (SMT), for example, on the surface of printed circuit boards (PCB) or other substrates Chip-type aluminum electrolytic capacitors are attracting great attention in the field of electronic equipment such as soldering assembly and electronic complete machine assembly. The main reason is that SMD aluminum capacitors have the characteristics of light weight, thin thickness, and small size, and are very suitable for various electronic products with compact structure, high precision, and small size, such as communication eq...

Claims

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Application Information

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IPC IPC(8): H01G9/035H01G9/145
Inventor 徐荣尹超尹志华
Owner 湖州新江浩电子有限公司
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