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Glass-based chip rewiring packaging structure and manufacturing method thereof

A technology of packaging structure and manufacturing method, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as high cost, technical difficulty, and complicated process, achieve excellent electrical performance, avoid complex processes, The effect of simplifying the process

Pending Publication Date: 2019-06-21
XIAMEN SKY SEMICON TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main problems are: it is necessary to make corresponding characteristic graphics on the surface of the slide (set the chip placement area); use temporary bonding process and equipment; must use wafer-level injection molding equipment and process; must use debonding equipment and process
The existing fan-out process is complex, technically difficult, and costly, which limits its application

Method used

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  • Glass-based chip rewiring packaging structure and manufacturing method thereof
  • Glass-based chip rewiring packaging structure and manufacturing method thereof
  • Glass-based chip rewiring packaging structure and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] refer to figure 1 , a fabrication method of a glass-based chip rewiring package structure, corresponding to figure 1 Schematic diagram of the structure obtained in each step, the specific steps are:

[0036] 1) Provide a glass substrate 1, the thickness of the glass substrate 1 can be selected to be similar to the thickness of the chip to be packaged;

[0037] 2) Process the glass substrate 1 by laser or etching to form a through hole 11 penetrating up and down, and the size of the through hole 11 is slightly larger than the chip to be packaged;

[0038] 3) Adhering the lower surface of the glass substrate 1 to the carrier 2 through the first bonding layer 3, the carrier 2 can be a glass substrate, a silicon substrate or a ceramic substrate, etc.;

[0039] 4) Provide a chip 5 with a first pad 51, place the pad of the chip 5 facing up in the through hole 11, and the bottom surface of the chip 5 is adhered to the carrier plate 2 at the bottom of the through hole 11 thro...

Embodiment 2

[0046] refer to image 3 The difference between embodiment 2 and embodiment 1 is that the carrier plate 2' of this embodiment is obtained after the carrier plate 2 in embodiment 1 is thinned, and the overall thickness is reduced to meet the use requirements.

Embodiment 3

[0048] refer to Figure 4 , The difference between embodiment 3 and embodiment 1 is that the step of removing the carrier plate is also included, and the final structure obtained does not contain the carrier plate, which further reduces the thickness.

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PUM

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Abstract

The invention discloses a glass-based chip rewiring packaging structure, comprising a glass substrate, a chip provided with a first bonding pad, a filling layer, a metal rewiring layer, a passivationlayer and a second bonding pad, wherein a through hole penetrating through upper and lower parts is formed in the glass substrate, the chip is disposed in the through hole, and the first bonding pad faces upward; the filling layer is filled in an arrangement gap of the through hole and the chip, extends to cover the glass substrate and an upper surface of the chip, and is open corresponding to thearea of the first bonding pad; the metal rewiring layer is disposed on the filling layer and is connected with the first bonding pad; the passivation layer is disposed on the metal rewiring layer andis provided with an opening; and the second bonding pad is disposed on the passivation layer and is connected with the metal rewiring layer. The invention also discloses a manufacturing method thereof. The chip rewiring structure disclosed by the invention is compact, ultra-thin packaging can be realized, meanwhile glass is used as the main material, thereby being more suitable for high-frequency devices and realizing better electric performance. Complicated processes of temporary bonding and debonding are avoided in the process, the reliability is excellent, and the cost is lower.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a glass-based chip rewiring packaging structure and a manufacturing method thereof. Background technique [0002] With the trend of multi-functionalization and miniaturization of electronic products, especially the development of smart phones, tablet computers, wearable devices and other products, chip functions are becoming more and more complex, chip size is getting smaller and smaller, and the number of I / Os is getting higher and higher. More and more, Fan-in (fan-in) packaging can no longer meet the requirements of I / O fan-out. Fan-out (fan-out) packaging technology is a supplement to fan-in packaging technology, and the chip I / O port is led out by reconfiguring the wafer. [0003] The fan-out process has been applied since 2008, mainly the eWLB (Embedded WaferLevel BGA) technology of Infineon Wireless. With the gradual maturity of process technology and the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498H01L21/48
CPCH01L2224/18H01L2224/24137
Inventor 姜峰王阳红
Owner XIAMEN SKY SEMICON TECH CO LTD
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