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Laser machining system and method

A laser processing method and laser processing technology, which are applied in the field of communication, can solve the problems of large laser cutting line offset and increased defect rate of workpieces to be processed, and achieve the goals of improving cutting quality, simplifying cutting process flow, and reducing defect rate Effect

Pending Publication Date: 2019-06-21
BOE TECH GRP CO LTD +1
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  • Abstract
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Problems solved by technology

[0004] The embodiment of the present invention provides a laser processing system and method to solve the problem in the prior art that due to multiple laser processing, there is a large deviation of the laser cutting line, which leads to an increase in the processing defect rate of the workpiece to be processed

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Embodiment Construction

[0039] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0040] In the embodiment of the present invention, the laser processing system includes at least two lasers, a focusing module and a beam combining module that are arranged one-to-one corresponding to the at least two lasers, wherein at least two lasers are used to generate at least two lasers The focus adjustment module is used to adjust the focus position of the laser beam generated by the corresponding laser, and the beam combination module is used t...

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Abstract

The invention provides a laser machining system and method. The laser machining system comprises at least two lasers, focusing modules and a beam combining module, wherein the lasers are used for generating at least two laser beams; the focusing modules are arranged corresponding to at least two lasers in a one-to-one mode, and are used for adjusting the focusing positions of the laser beams generated by the corresponding lasers; and the beam combining module is used for receiving at least two laser beams with the adjusted focusing positions and coaxially outputting at least two laser beams. According to the system, the cutting quality of a to-be-machined workpiece can be improved, the reject ratio of the to-be-machined workpiece can be effectively reduced, meanwhile, the application rangeof the lasers can be expanded, and the flexibility of adjusting the focusing positions of the laser beams generated by the lasers can be improved.

Description

technical field [0001] The invention relates to the field of communication technology, in particular to a laser processing system and method. Background technique [0002] Due to its excellent characteristics such as precision, process flexibility, non-contact processing type, and thermal influence on materials, laser cutting is rapidly expanding in the application field of the entire industry. The energy density of the laser beam has a maximum value at the very center of the focus point of the laser beam, and the energy density gradually decreases from the center to the outside. [0003] Therefore, when the thickness of the workpiece to be processed is greater than the thickness of the area where the energy of the laser beam is focused, multiple times of laser processing are required to cut the workpiece to be processed. However, in the process of multiple times of laser cutting the workpiece to be processed, there is a problem that the large offset of the laser cutting li...

Claims

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Application Information

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IPC IPC(8): B23K26/06B23K26/064
CPCB23K26/064B23K26/0617B23K26/0624B23K26/38B23K26/082B23K2101/36B23K2103/54B23K26/0604B23K26/0648
Inventor 胡红伟卿万梅辛燕霞于名印佘建民李雪萍曹英冯巧
Owner BOE TECH GRP CO LTD
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