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A piezoresistive sensor with a porous structure and its preparation method

A piezoresistive sensor and porous structure technology, applied in the field of sensors, can solve the problems that the deformation cannot be kept well synchronized, the pressure-sensitive layer is cracked or peeled off, and the application field of the sensor is limited, so as to achieve a large area, low cost, and a preparation method. Novel and simple, low elastic modulus effect

Active Publication Date: 2021-01-19
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the one hand, the microstructure of such a uniform height limits the deformation space in the pressure direction during loading due to the small height of the pyramids; The contact area increases, so the change in effective area is small with the change of pressure, that is, its sensitivity is relatively small, which limits the application field of the sensor. In addition, the core part of this piezoresistive sensor often adopts the structure of substrate, support layer, pressure The sensitive layer is composed of three layers. Since the Young’s modulus of the pressure-sensitive layer is relatively high, using a support layer with a lower Young’s modulus to compound it can reduce the Young’s modulus of the device as a whole and improve its flexibility. However, this structure also has Achilles' heel, due to the difference in Young's modulus between the support layer and the pressure-sensitive layer, when the sensor is repeatedly pressed during use, the deformation of the two cannot be kept in sync, and the pressure-sensitive layer will crack or fall off after a long time. So this structure makes the life of the sensor limited

Method used

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  • A piezoresistive sensor with a porous structure and its preparation method
  • A piezoresistive sensor with a porous structure and its preparation method
  • A piezoresistive sensor with a porous structure and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Embodiment 1: Preparation of porous piezoresistive sensor when rice wine is 8.2%

[0030] Concrete preparation is carried out as follows:

[0031] a. Weigh 0.6g of rice wine and 0.1g of starch into a plastic container, add 2ml of water to dissolve, and use a speedmixer to mix the above mixture at a speed of 2000r / min for 10s.

[0032] b. Weigh 0.6g of acetylene black, 3g of Ecoflex-A and 3g of Ecoflex-B into the above mixture, and add 1ml of ethanol to prevent the mixture from agglomerating, and then use a speedmixer to mix the mixture at a speed of 2000r / min for 10s.

[0033] c. Take out the well-mixed slurry and pour it into a concave glass mold of 2cm×2cm×3mm.

[0034] d. Put the glass mold containing the slurry into a vacuum drying oven, debubble the slurry in a vacuum environment, keep it for 10 minutes, and take out the slurry.

[0035]e. Use a glass plate to flatten the surface of the slurry to reduce irregular protrusions, put the glass mold into the heating p...

Embodiment 2

[0037] Embodiment 2: Preparation of porous piezoresistive sensor when rice wine is 17.3%

[0038] Concrete preparation is carried out as follows:

[0039] a. Weigh 1.4g of rice wine and 0.1g of starch into a plastic container, add 2ml of water to dissolve, and use a speedmixer to mix the above mixture at a speed of 2000r / min for 10s.

[0040] b. Weigh 0.6g of acetylene black, 3g of Ecoflex-A and 3g of Ecoflex-B into the above mixture, and add 1ml of ethanol to prevent the mixture from agglomerating, and then use a speedmixer to mix the mixture at a speed of 2000r / min for 10s.

[0041] c. Take out the well-mixed slurry and pour it into a concave glass mold of 2cm×2cm×3mm.

[0042] d. Put the glass mold containing the slurry into a vacuum drying oven, debubble the slurry in a vacuum environment, keep it for 10 minutes, and take out the slurry.

[0043] e. Use a glass plate to flatten the surface of the slurry to reduce irregular protrusions, put the glass mold into the heating...

Embodiment 3

[0045] Example 3: Preparation of piezoresistive sensor when the heating temperature is 60°C

[0046] Concrete preparation is carried out as follows:

[0047] a. Weigh 1.2g of rice wine and 0.1g of starch into a plastic container, add 2ml of water to dissolve, and use a speedmixer to mix the above mixture at a speed of 2000r / min for 10s.

[0048] b. Weigh 0.6g of acetylene black, 3g of Ecoflex-A and 3g of Ecoflex-B into the above mixture, and add 1ml of ethanol to prevent the mixture from agglomerating, and then use a speedmixer to mix the mixture at a speed of 2000r / min for 10s.

[0049] c. Take out the well-mixed slurry and pour it into a concave glass mold of 2cm×2cm×3mm.

[0050] d. Put the glass mold containing the slurry into a vacuum drying oven, debubble the slurry in a vacuum environment, keep it for 10 minutes, and take out the slurry.

[0051] e, Use a glass plate to scrape the surface of the slurry to reduce irregular protrusions, put the glass mold into the heati...

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Abstract

The invention discloses a piezoresistive sensor with a porous structure and a preparation method thereof. The piezoresistive sensor structure comprises, in order from the outside to the inside, a flexible protective layer, an electrode sheet and a pressure sensitive sensing layer, wherein the pressure sensitive sensing layer is a foam structure formed by mixing and foaming Ecoflex used as a substrate and acetylene black used as a conductive phase by using rice wine and starch, and has a sensitivity up to 0.272 kPa-1 in the total pressure sensitive range. The piezoresistive sensor and the preparation method thereof are novel and simple, have excellent performance and low cost, and have great potential and advantages in the field of biomedical detection and robotics.

Description

technical field [0001] The invention belongs to the field of sensors, and relates to a piezoresistive sensor and a preparation method thereof, in particular to a porous piezoresistive sensor with a certain pore size distribution and a preparation method thereof. Background technique [0002] As a detection device that converts mechanical signals into electrical signals, piezoresistive sensors play an important role in the current society and are also a key component of the Internet of Things. Traditional piezoresistive sensors are mainly silicon-based piezoresistive sensors. This type of sensor has High integration, high sensitivity and other excellent features, but due to the high hardness of silicon, the shape of this piezoresistive sensor cannot be changed flexibly, which limits its scope of application. In contrast, flexible piezoresistive sensors have a relatively low Young’s modulus, and have better adaptability and adhesion to various irregularly shaped detection envi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L41/16H01L41/35H01L41/23A61B5/00A61B5/22
Inventor 王宗荣简阅陈国瑞王珊李皓盛周麟铭张震岳苗雨欣牛韶玉刘剑董亚波王洪柱杜丕一
Owner ZHEJIANG UNIV
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