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Method for recovering copper and tin in waste tin-plated and copper-coated plates

A copper-clad laminate and tin-plating technology, which is applied in the field of recycling copper and tin in waste tin-plated copper-clad laminates, can solve a large amount of waste water and other problems, achieve high recovery rate, simple process flow, and facilitate industrialization.

Inactive Publication Date: 2019-05-31
HUNAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This patent uses mixed acid to recycle copper clad laminates, but there is a problem that a large amount of waste water will be generated

Method used

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  • Method for recovering copper and tin in waste tin-plated and copper-coated plates

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Embodiment 1

[0040] One of the method implementations of copper and tin in a kind of recycling waste tin-plated copper-clad laminate of the present invention, such as figure 1 Show, the content of metal tin in the copper-tin powder in the present embodiment is 5.44%, and the content of copper is 90.21%, and resin powder slag and other metal content are 4.35%.

[0041] A method for reclaiming copper and tin in waste tinned copper-clad laminates of the present invention, its technological process is as follows figure 1 shown, including the following steps:

[0042] (1) Carry out mechanical primary crushing and crushing of waste tinned copper-clad laminates to obtain copper-clad laminate powder;

[0043] (2) Sorting the copper-clad laminate powder through a hydraulic shaker to obtain copper-tin powder and non-metallic powder;

[0044] (3) Mix the copper tin powder and the leaching solution in two batches with a solid-to-liquid ratio of 1:4 and add them to a three-necked flask for leaching. ...

Embodiment 2

[0051] One of the embodiments of the method for recycling copper and tin in waste tin-plated copper-clad laminates of the present invention, the main technical solution of this embodiment 2 is basically the same as that of embodiment 1, and the features not explained in this embodiment 2, The explanation in Embodiment 1 is adopted, and details are not repeated here. The difference between this example and Example 1 is that in step (3), the copper-tin powder and the leaching solution are mixed into a three-necked flask with a solid-to-liquid ratio of 1:5, and the initial feeding is 60%, and the second feeding is 40%. Raise the temperature to 70°C for leaching reaction for 20 minutes, wherein the concentration of sulfuric acid is 80ml / L, CuCl 2 The concentration is 30g / L.

[0052] After testing, the metal copper content is 99.83%, the metal tin content is 0.17%, and the tin oxide purity is 99.25%.

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Abstract

The invention discloses a method for recovering copper and tin in waste tin-plated and copper-coated plates. The waste tin-plated and copper-coated plates are crushed and sorted to obtain copper tin powder and nonmetal powder; the copper tin powder is fed in leaching liquid twice; mixtures are leached through solid-liquid separation to obtain metal copper powder and tin removing liquid; the tin removing liquid is hydrolyzed; the solid-liquid separation is performed on hydrolyzed products to obtain tin hydroxide; and the tin hydroxide is dried and roasted to obtain tin dioxide powder. The copper and the tin in the waste tin-plated and copper-coated plates are recovered with high value in forms of the metal copper and the tin dioxide. The method is simple in process flow, can recycle raw materials and by-products in the production process, achieves zero emission, low energy consumption, economy and environmental protection, and is more common in raw material and equipment, higher in recovery rate of the metal tin, low in energy consumption, lower in equipment requirement and convenient to industrially popularize.

Description

technical field [0001] The invention belongs to the technical field of recycling or refining metals, in particular to a method for recycling copper and tin in waste tinned copper-clad laminates. Background technique [0002] Copper clad laminate is the basic material for making printed circuit boards, and is widely used in electronic products such as televisions, computers, and mobile communication equipment. The development of electronic technology and the upgrading of electronic products have led to a sharp increase in the amount of copper-clad laminate scraps and waste copper-clad laminates produced in the large-scale production process. Among them, the content of precious metals such as copper and tin is as high as 20-30%, and tin in the metal of copper-clad laminates The content is about 2-10%, and the copper content is about 90-98%. Metal resources are increasingly scarce, and the international copper and tin prices remain high. Copper and tin have high recycling value...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22B7/00C22B1/00C22B15/00C22B25/06
CPCY02P10/20
Inventor 伍泽广彭准令玉林徐文亮万炜刘攀雷小康梁泽燊程晓慧
Owner HUNAN UNIV OF SCI & TECH
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