Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

PCB non-drilling-through solving method

A PCB board and drill-through technology, which is applied in the direction of electrical components, printed circuit manufacturing, printed circuits, etc., can solve the problems of multi-layer board drill pin breakage, inability to drill through multi-layer boards, time-consuming and labor-intensive problems, and reduce single work Effects of time, temperature reduction, and drilling depth reduction

Inactive Publication Date: 2019-05-21
GUANGDONG CHAMPION ASIA ELECTRONICS CO LTD
View PDF8 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing multi-layer board drilling process of PCB, the drilling operation is directly performed on the PCB board with the drill needle, which is not only time-consuming and laborious, but also easily breaks the drill needle due to the excessive thickness of the multi-layer board, resulting in failure to drill through. multilayer board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A method for solving PCB board not drilled through, comprising the following steps:

[0027] S1. Measure the thickness of the multilayer board, and select a drill pin of appropriate length according to the thickness of the multilayer board;

[0028] S2, according to the thickness of the multi-layer board, the multi-layer board is divided into three layers of drilling layers, wherein the thickness of each drilling layer is the same;

[0029] S3. Use a drilling rig to drill the multi-layer board. During the drilling process, firstly perform the drilling operation on the uppermost drilling layer according to the drill belt data, and clean the drill cuttings in the hole after the drilling is completed;

[0030] S4. Drill the next layer of the drill layer according to the drill tape, and clean up the drill cuttings in the hole after drilling, and so on until the multi-layer board is drilled.

Embodiment 2

[0032] A method for solving PCB board not drilled through, comprising the following steps:

[0033] S0. Prepare a bottom plate and fix the bottom plate on the drilling platform of the drilling rig so that the surface of the bottom plate is in a horizontal state, and then fix the multi-layer board on the bottom plate.

[0034] S1. Measure the thickness of the multilayer board, and select a drill pin of appropriate length according to the thickness of the multilayer board;

[0035] S2, according to the thickness of the multi-layer board, the multi-layer board is divided into three layers of drilling layers, wherein the thickness of each drilling layer is the same;

[0036] S3. Use a drilling rig to drill the multi-layer board. During the drilling process, firstly perform the drilling operation on the uppermost drilling layer according to the drill belt data, and clean the drill cuttings in the hole after the drilling is completed;

[0037] S4. Drill the next layer of the drill ...

Embodiment 3

[0039] A method for solving PCB board not drilled through, comprising the following steps:

[0040] S0. Measure the thickness of the multi-layer board, prepare a bottom plate, and fix the bottom plate on the drilling platform of the drilling rig, so that the surface of the bottom plate is in a horizontal state, and fix four end-to-end baffles around the bottom plate, and make the baffle The inner side is tightly against the edge of the multilayer board to fix the multilayer board.

[0041] S1. According to the thickness of the multi-layer board, select the appropriate length of the drill;

[0042] S2, divide the multi-layer board into two layers of drilling layers according to the thickness of the multi-layer board, wherein the thickness of each drilling layer is the same;

[0043] S3. Use a drilling rig to drill the multi-layer board. During the drilling process, firstly perform the drilling operation on the uppermost drilling layer according to the drill belt data, and clea...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a PCB non-drilling-through solving method. The method comprises the steps that S1, the thickness of a multilayer board is measured, and a drill bit with appropriate length isselected according to the thickness of the multilayer board; S2, the multilayer board is divided into multiple layers according to the thickness of the multilayer board for drilling, wherein the thicknesses of all the drilling layers are equal; S3, a drilling machine is used to perform drilling operation on the multilayer board, wherein in the drilling process, drilling operation is performed on the uppermost drilling layer according to data on a drilling tape first, and drilling cuttings in holes are cleared up after drilling is completed; and S4, drilling operation is performed on the next drilling layer according to the drilling tape, the drilling cuttings in the holes are cleared up after drilling is completed, and the process is repeated till the multilayer board is drilled through. Through the method, the situation that the drill bit is broken and cannot drill through the multilayer board can be effectively prevented.

Description

technical field [0001] The invention relates to the field of PCBs, in particular to a method for solving the problem of undrilled PCB boards. Background technique [0002] PCB is the support of electronic components and the carrier of electrical connections. It is one of the important components of the electronics industry. It is used in almost every kind of electronic equipment, ranging from electronic watches and calculators to computers, communication electronic equipment, and military weapons. System size. In the existing multi-layer board drilling process of PCB, the drilling operation is directly performed on the PCB board with the drill needle, which is not only time-consuming and laborious, but also easily breaks the drill needle due to the excessive thickness of the multi-layer board, resulting in failure to drill through. multilayer board. Contents of the invention [0003] Based on this, it is necessary to provide a method to solve the problem that the PCB boa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
Inventor 刘继承邹乾坤李强
Owner GUANGDONG CHAMPION ASIA ELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com