A Simple Steady State Test System for Thermal Conductivity of High Thermal Conductivity Materials

Abstract

The invention discloses a simple and simple steady-state testing system for thermal conductivity of high thermal conductivity materials. During the test, the heating section is heated with constant power through the connection of the heating system and the electric heating film, the cooling system is connected with the cooling chamber to cool the cooling section at a constant temperature, and the data acquisition and processing system is connected with the thermocouple to complete the process of the tested high thermal conductivity material. Real-time acquisition and output of temperature. In addition, heat insulation materials are used to insulate the heating section and the insulation section of the tested high thermal conductivity material during the test, so that the heat is transferred along the length direction of the tested high thermal conductivity material, forming a one-dimensional stability of the tested high thermal conductivity material along the length direction. State-to-state heat transfer can realize a large temperature difference along the surface of the tested high thermal conductivity material under a small heating power, ensuring a certain test accuracy. The invention can solve the problems in the prior art that when testing the thermal conductivity of high thermal conductivity materials, the sample size is large, the heating power is large, it is difficult to implement, the test accuracy is low, and the thermal conductivity of the material cannot be obtained through a one-time test.

Description

technical field [0001] The invention belongs to the technical field of thermal physical property testing, and in particular relates to a simple steady-state testing system for thermal conductivity of high thermal conductivity materials. The test of thermal conductivity of materials is especially suitable for the thermal conductivity test of various high thermal conductivity materials (aluminum, copper, graphite, etc.) that are difficult to process in large size (length, width and height). Background technique [0002] High thermal conductivity materials (aluminum, copper, graphite, etc.) are widely used in aerospace, low-temperature buildings, and heat dissipation of electronic devices. When these materials are designed and applied in related fields, their thermal properties must be accurately tested to be more reasonable and efficient. Use it efficiently. As one of the most important thermophysical parameters to characterize materials, thermal conductivity plays a key role...

AI Technical Summary

Problems solved by technology

The invention can solve the problems in the prior art that when testing the thermal conductivity of high thermal conductivity materials, the sample size is large, the heating power is large, it is difficult to implement, the test accuracy is low, and the thermal conductivity of the material cannot be obtained through a one-time test.

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