Simple high-thermal-conductivity material thermal conductivity coefficient steady-state test system

Abstract

The invention discloses a simple high-thermal-conductivity material thermal conductivity coefficient steady-state test system. During testing, a heating system is connected with an electric heating film to heat a heating section at constant power, a cooling system is connected with a cooling cavity to cool the cooling section at constant temperature, and a data acquisition and processing system isconnected with a thermocouple to complete real-time acquisition and output of a tested high-thermal-conductivity material along-the-way temperature. In the testing process, the heating section and the heat preservation section of the tested high-heat-conductivity material are subjected to heat insulation and heat preservation by adopting a heat preservation material; the heat is transferred in the length direction of the tested high-thermal-conductivity material to form one-dimensional steady-state heat transfer of the tested high-thermal-conductivity material in the length direction, so thatthe surface of the tested high-thermal-conductivity material has relatively large temperature difference along the way under relatively low heating power, and certain testing precision is ensured. The problems that in the prior art, when the heat conductivity coefficient of the high-heat-conductivity material is tested, the sample size is large, the heating power is large, implementation is difficult, the testing precision is low, and the heat conductivity coefficient of the material cannot be obtained through one-time testing can be solved.

Description

technical field [0001] The invention belongs to the technical field of thermophysical property testing, and in particular relates to a simple steady-state test system for thermal conductivity of high thermal conductivity materials. The test of material thermal conductivity is especially suitable for the thermal conductivity test of various high thermal conductivity materials (aluminum, copper, graphite, etc.) that are not easy to process in large size (length, width and height). Background technique [0002] High thermal conductivity materials (aluminum, copper, graphite, etc.) are widely used in aerospace, low-temperature construction, and heat dissipation of electronic devices. When designing and applying these materials to related fields, it is necessary to accurately test their thermal properties to be more reasonable. Use it efficiently. As one of the most important thermophysical parameters to characterize materials, thermal conductivity plays a key role in the analys...

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Problems solved by technology

The invention can solve the problems in the prior art that when testing the thermal conductivity of high thermal conductivity materials, the sample size is large, the heating power is large, it is difficult to implement, the test accuracy is low, and the thermal conductivity of the material cannot be obtained through a one-time test.

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