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Preparation method of heat dissipation layer of heat sink as well as heat sink

A heat dissipation layer and heat sink technology, which is applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve the problems of poor heat dissipation improvement effect of heat sinks, etc., to improve heat dissipation effect, avoid corrosion, and increase service life Effect

Active Publication Date: 2019-05-17
深圳天元羲王材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the embodiments of the present invention is to provide a heat dissipation layer preparation method of a radiator and a radiator, aiming to solve the problem that the heat dissipation layer has a poor effect on improving the heat dissipation of the radiator after the heat dissipation layer of the existing radiator is prepared

Method used

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  • Preparation method of heat dissipation layer of heat sink as well as heat sink
  • Preparation method of heat dissipation layer of heat sink as well as heat sink
  • Preparation method of heat dissipation layer of heat sink as well as heat sink

Examples

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Embodiment 1

[0045] see figure 1 , is a flow chart of the method for preparing the heat dissipation layer of the radiator provided in the first embodiment of the present invention, including steps:

[0046] Step S10, cleaning the surface of the radiator, and placing the cleaned radiator in a vacuum high-temperature box;

[0047] Wherein, in this step, the cleaning operation of the surface of the radiator is performed by means of an automatic cleaner to improve cleaning efficiency, and the driving of the radiator in this step is automatically completed by a mechanical arm. There is a driver program, and after the mechanical arm runs the corresponding driver program, it can automatically complete the driving of the radiator, that is, place the cleaned radiator in the vacuum high-temperature box. Specifically, in this embodiment, the vacuum high-temperature The box is used for heat preservation effect on the preparation of the heat dissipation layer on the surface of the radiator, so as to i...

Embodiment 2

[0063] see figure 2 , is a flow chart of the method for preparing the heat dissipation layer of the radiator provided in the second embodiment of the present invention, including steps:

[0064] Step S11, cleaning the surface of the radiator, and placing the cleaned radiator in a vacuum high-temperature box;

[0065] Wherein, in this step, the cleaning operation of the surface of the radiator is performed by means of an automatic cleaner to improve cleaning efficiency, and the driving of the radiator in this step is automatically completed by a mechanical arm. There is a driver program, and after the mechanical arm runs the corresponding driver program, it can automatically complete the driving of the radiator, that is, place the cleaned radiator in the vacuum high-temperature box. Specifically, in this embodiment, the vacuum high-temperature The box is used for heat preservation effect on the preparation of the heat dissipation layer on the surface of the radiator, so as to...

Embodiment 3

[0093] see image 3 , is a flow chart of the method for preparing a heat dissipation layer of a radiator provided in the third embodiment of the present invention, including steps:

[0094] Step S12, cleaning the surface of the radiator, and placing the cleaned radiator in a vacuum high-temperature box;

[0095] Wherein, in this step, the cleaning operation of the surface of the radiator is performed by means of an automatic cleaner to improve cleaning efficiency, and the driving of the radiator in this step is automatically completed by a mechanical arm. There is a driver program, and after the mechanical arm runs the corresponding driver program, it can automatically complete the driving of the radiator, that is, place the cleaned radiator in the vacuum high-temperature box. Specifically, in this embodiment, the vacuum high-temperature The box is used for heat preservation effect on the preparation of the heat dissipation layer on the surface of the radiator, so as to impro...

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Abstract

The invention provides a preparation method of a heat dissipation layer of a heat sink as well as a heat sink. The preparation method comprises the following steps: cleaning the surface of a heat sink, and placing the cleaned heat sink in a vacuum high temperature box; filling the vacuum high temperature box with methane, and judging whether gas in the vacuum high temperature box meets heating reaction conditions; if yes, heating the vacuum high temperature box, so as to control the methane to be heated and decomposed into carbon and hydrogen; performing cooling and pressure relief on the vacuum high temperature box, so as to control the carbon to adsorb graphene and form a graphene heat dissipation layer, and judging whether the graphene heat dissipation layer meets carbon adsorption completion conditions; and if yes, taking out the heat sink. The preparation method is designed by adopting a method of generating a carbon source by heating and decomposing the methane, so that the generated graphene can be effectively and directly bonded with the surface of the heat sink, other materials like adhesive do not exist in the middle, heat of the heat sink can be fully transferred onto the graphene heat dissipation layer, and heat dissipation effect of the heat sink is improved.

Description

technical field [0001] The invention belongs to the field of radiators, in particular to a method for preparing a heat dissipation layer of a radiator and a radiator. Background technique [0002] The current radiators are all made of metal materials to increase the surface area as much as possible, so that they can be mounted on the surface of the heating device, so as to achieve the effect of dissipating the heat emitted during the heating period. With the emergence of graphene, many people gradually pay attention to this new material. Because graphene has super thermal conductivity and electrical conductivity. Therefore, it is also concerned by the heat dissipation market, and it is hoped that its excellent heat conductivity can help solve the problem of heat dissipation. [0003] For this reason, graphene heat dissipation coatings are popular. The main method is to stir the graphene in the paint, and then apply the graphene paint on the surface of the radiator to form...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L23/367
Inventor 伍连彬
Owner 深圳天元羲王材料科技有限公司
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