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Polyimide precursor, precursor composition, polyimide, high-temperature-resistant transaprent polyimide film and preparation method of high-temperature-resistant transaprent polyimide film

A polyimide precursor and transparent polyimide technology, which is applied in the field of polymer material synthesis, can solve the problems of high transparent polyimide heat resistance and mechanical performance degradation, achieve good light transmittance, improve Regularity, the effect of improving efficiency

Active Publication Date: 2019-05-10
株洲时代华昇新材料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention overcomes the deficiencies and defects mentioned in the above background technology, provides a polyimide precursor, a precursor composition, a high-temperature-resistant transparent polyimide film and a preparation method thereof, and mainly solves the problem of high-transparency polyimide Problems of decreased heat resistance and decreased mechanical properties

Method used

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  • Polyimide precursor, precursor composition, polyimide, high-temperature-resistant transaprent polyimide film and preparation method of high-temperature-resistant transaprent polyimide film
  • Polyimide precursor, precursor composition, polyimide, high-temperature-resistant transaprent polyimide film and preparation method of high-temperature-resistant transaprent polyimide film
  • Polyimide precursor, precursor composition, polyimide, high-temperature-resistant transaprent polyimide film and preparation method of high-temperature-resistant transaprent polyimide film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] A high-temperature-resistant transparent polyimide film, which is produced by thermal imidization method, and is obtained by casting a polyamic acid precursor composition and temperature-programmed treatment;

[0057] Wherein, the polyamic acid precursor accounts for the mass content of composition and is 10wt%;

[0058] The diamine monomer used is 2,2-bis[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, and the main dianhydride monomer is 4 , 4-(hexafluoroisopropylene) diphthalic anhydride, the dianhydride monomer is 4,4'-oxydiphthalic anhydride;

[0059] The main dianhydride monomer accounts for 70% of the total molar amount of dianhydride, and the controlled dianhydride monomer accounts for 30% of the total molar amount of dianhydride;

[0060] The temperature programming sequence is: room temperature—100°C (10min)—180°C (10min)—260°C (10min)—320°C (10min).

Embodiment 2

[0062] A high-temperature-resistant transparent polyimide film, which is produced by chemical imidization method, is obtained by mixing polyamic acid precursor composition and accelerator, casting and temperature-programmed treatment;

[0063] Wherein, the polyamic acid precursor accounts for the mass content of composition and is 10wt%;

[0064] The diamine monomer used is 2,2-bis[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, and the main dianhydride monomer is 4 , 4-(hexafluoroisopropylene) diphthalic anhydride, the dianhydride monomer is 4,4'-oxydiphthalic anhydride;

[0065] The main dianhydride monomer accounts for 70% of the total molar amount of dianhydride, and the controlled dianhydride monomer accounts for 30% of the total molar amount of dianhydride;

[0066] The accelerator is composed of pyridine and acetic anhydride in a mass ratio of 1:1, the mass ratio of the sum of the catalyst and dehydrating agent to the solvent is 3:7; the mass ratio of the prec...

Embodiment 3

[0069] A high-temperature-resistant transparent polyimide film, which is produced by chemical imidization method, is obtained by mixing polyamic acid precursor composition and accelerator, casting and temperature-programmed treatment;

[0070] Wherein, the polyamic acid precursor accounts for the mass content of composition and is 10wt%;

[0071] The diamine monomer used is 2,2-bis[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, and the main dianhydride monomer is 4 , 4-(hexafluoroisopropylene) diphthalic anhydride, the dianhydride monomer is 4,4'-oxydiphthalic anhydride;

[0072] The main dianhydride monomer accounts for 70% of the total molar amount of dianhydride, and the controlled dianhydride monomer accounts for 30% of the total molar amount of dianhydride;

[0073] The accelerator is composed of pyridine and acetic anhydride in a mass ratio of 1:1; the mass ratio of the sum of the catalyst and dehydrating agent to the solvent is 3:6; the mass ratio of the prec...

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Abstract

The invention discloses a polyimide precursor, a precursor composition, polyimide, high-temperature-resistant transaprent polyimide film and a preparation method of the high-temperature-resistant transaprent polyimide film. The polyimide precursor is polyamide acid having a general formula which is shown in the description, wherein A is a structural unit derived from a diamine, B1 is a structuralunit derived from a main dianhydride, B2 is a structural unit derived from a control dianhydride, and the control dianhydride is from one or more than two of the structures which are shown in the description; the high-temperature-resistant transaprent polyimide film is prepared with the precursor composition by means of a thermal imidization process or a chemical imidization process. The high-heat-resistant colorless transparent polyimide herein has light transmittance of up to 88% and above, for example, 88-90%, has glass transition temperature of 336 DEG C and above, for instance, 336-360 DEG C, and further 350-360 DEG C, and has coefficient of linear expansion of 15-21 ppm / K, tensile strength of 109-120 MPa and elongation at break of 20-26%.

Description

technical field [0001] The invention belongs to the field of polymer material synthesis, and in particular relates to a polyimide precursor, a precursor composition, a high-temperature-resistant transparent polyimide film and a preparation method thereof. Background technique [0002] With the development of science and technology, the display field is gradually developing in the direction of large-scale, thin and flexible. The use of flexible transparent polymers to replace traditional hard glass in display devices is a key technology to achieve flexible displays. Polyimide has outstanding heat resistance and can withstand high-temperature processes such as electrode film deposition and annealing during the display process, and has attracted widespread attention in the industry. [0003] Due to the strong intermolecular and intramolecular interactions in the molecular structure of traditional aromatic polyimides, it is easy to form a charge transfer complex between the ele...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08J5/18
Inventor 江乾刘亦武王倩段瑨王进姜其斌
Owner 株洲时代华昇新材料技术有限公司
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