Welding slag sweeping roller for processing of electronic circuit board

A technology for electronic circuit boards and cleaning rollers, which is applied to the cleaning method using tools, non-electric welding equipment, metal processing equipment, etc., can solve the problems of welding slag falling into the machine, the impact of sonic welding, and damage to the machine, etc., to improve cleaning effect of effect

Inactive Publication Date: 2019-05-03
HENAN HUANQIU AVIATION EQUIP TECH CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, when electronic circuit boards are processed and welded, sonic welding is used, but there is a gap between the electric head frame of the sonic welding device and the sonic welding frame, and welding slag will accumulate in the gap. impact on the environment, once the welding slag falls into the machine, it will even damage the machine

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Welding slag sweeping roller for processing of electronic circuit board
  • Welding slag sweeping roller for processing of electronic circuit board
  • Welding slag sweeping roller for processing of electronic circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] see figure 1 with figure 2 , in an embodiment of the present invention, a welding slag cleaning roller for electronic circuit board processing includes an outer fixed shell 1, and a roller body 2 is installed at the lower end of the outer fixed shell 1. In order to clean up the welding slag, the roller body 2 is There are fixed magnet plates 14 distributed at equal intervals. In order to improve the cleaning effect of welding slag, brush strips 15 are fixed on the roller bodies 2 on both sides of the magnet plate 14, and bristles are laid on the brush strips 15 to avoid excessive adsorption of the magnet plates 14. Welding slag further affects the adsorption effect. A conveyor belt 12 is installed inside the outer fixed shell 1. Arrayed scrapers 13 are welded on the conveyor belt 12. The angle between the scrapers 13 and the conveyor belt 12 is set at 60 degrees.

[0026] Further, the first rotating shaft 5 is fixed on the left end of the roller body 2, the second rot...

Embodiment 2

[0028] A welding slag cleaning roller for electronic circuit board processing, please refer to figure 2 with image 3 , the embodiment of the present invention is on the basis of embodiment 1, and further, a slag storage box 20 is installed inside the outer fixed shell 1 in conjunction with the conveyor belt 12, and a cavity 16 is arranged inside the slag storage box 20, and the cavity 16 is fixed inside A magnet block 17 is arranged, and a storage box 19 is provided at the lower end of the cavity 16, and a slag discharge pipe is installed on the storage box 19, and a through hole 18 is provided between the storage box 19 and the cavity 16.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Angleaaaaaaaaaa
Login to view more

Abstract

The invention discloses a welding slag welding roller for processing of an electronic circuit board. The welding slag sweeping roller comprises an outer fixation shell, wherein a roller body is installed on the lower end of the fixation shell; magnetic plates are fixed and distributed on the roller body by an equal interval; sweeping strips are fixed on the roller body located on both sides of themagnetic plates; a conveying belt is installed in the outer fixation shell; and scraping plates distributed in an array are welded on the conveying belt. The welding slag sweeping roller for processing of the electronic circuit board disclosed by the invention has the advantages that welding slag can be effectively cleaned with the magnetic plates, and the sweeping strips on both sides of the magnetic plates can sweep the welding slag upwards to increase cleaning effects of the welding slag; and the scraping plates welded on the conveying belt can prevent the magnetic plates from absorbing too much welding slag and thus influencing absorption effects.

Description

technical field [0001] The invention relates to a welding slag cleaning roller, in particular to a welding slag cleaning roller for electronic circuit board processing. Background technique [0002] Ultrasonic welding refers to a special welding method that uses mechanical vibration energy at ultrasonic frequencies to join metals. During ultrasonic welding, high-temperature heat energy is not input to the workpiece, but the elastic vibration energy is converted into vibration of the workpiece under static pressure, so that the workpieces are combined. This combination of joints without melting is called solid state welding. [0003] At present, when electronic circuit boards are processed and welded, sonic welding is used, but there is a gap between the electric head frame of the sonic welding device and the sonic welding frame, and welding slag will accumulate in the gap. It will affect the environment, and once the welding slag falls into the machine, it will even damage...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B08B1/00B08B1/04B08B15/04B03C1/02B23K20/26
Inventor 王飞
Owner HENAN HUANQIU AVIATION EQUIP TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap