An edge cutting device for pcb substrate production

Abstract

The invention discloses an edge cutting device for PCB substrate production, which includes a support mechanism and a protective baffle. The bottom end of the cylinder is threadedly connected with a cutting mechanism, and a platform mechanism is fixed directly below the cutting mechanism, and the protective baffle is fixedly arranged on both sides of the platform mechanism by welding. The edge cutting equipment used for the production of PCB substrates is provided with a locking plate, accompanied by clamping parts to clamp from both sides of the workpiece, the device is manually controlled so that the locking plate covers the positive side of the workpiece with the action of movable offset Above, the device utilizes the structure that the locking plate is set just above the workpiece. It can be set that the setting of the locking plate will lock and limit the placement of the workpiece from directly above, effectively reducing the The number of times separation between the workpiece and the operator panel occurred.

Description

technical field [0001] The invention relates to the technical field of PCB substrate production, in particular to an edge cutting device for PCB substrate production. Background technique [0002] The names of the circuit boards are: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin Thin circuit boards, printed (copper etching technology) circuit boards, etc. The circuit board makes the circuit miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and the optimization of the layout of electrical appliances. The cutting process is a process that needs to be passed during the production process of PCB substrates. In one step, the corresponding cutting equipment needs to be used during processing. [0003] When the cutting equipment on the market ...

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a kind of edge cutting equipment for PCB substrate production, to solve the problem that when the cutting equipment proposed in the above-mentioned background technology cuts the PCB substrate, since the whole device is not provided with a locking structure when clamping the workpiece, The workpiece is extremely easy to separate from the entire operation panel during the cutting process, which reduces the work efficiency of the entire cutting operation

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