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Chip box taking and placing mechanism and shaking device of semiconductor wet process soaking tank

A technology of wet process and soaking tank, which is applied in the field of semiconductor wet process preparation equipment, and can solve problems such as troublesome picking and placing of cassettes, affecting process efficiency, and complex structure

Active Publication Date: 2019-04-19
BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the structure of semiconductor wet etching process equipment in the prior art is generally more complicated, especially the process of taking and placing the cassette is more troublesome, often requiring manual unlocking or manual locking of the clamping mechanism of the cassette in the equipment, which seriously affects the process efficiency

Method used

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  • Chip box taking and placing mechanism and shaking device of semiconductor wet process soaking tank
  • Chip box taking and placing mechanism and shaking device of semiconductor wet process soaking tank

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Embodiment Construction

[0050] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0051] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, ...

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Abstract

The invention relates to a chip box taking and placing mechanism and a shaking device of a semiconductor wet process soaking tank. The mechanism comprises a connecting plate, a frame, a baffle and a driving transmission device, wherein the connecting plate is used for connecting the frame and the driving transmission device, the frame is used for containing a film magazine, and the baffle is arranged on the frame through a vertical rotating shaft and can change the clamping and pressing state of a chip box in the frame under the driving of the driving transmission device. The device comprisesthe mechanism. The chip box taking and placing mechanism and the shaking device have the advantages of being high in chip box taking and placing efficiency, easy and convenient to operate and simple in structure.

Description

technical field [0001] The invention relates to the technical field of semiconductor wet process preparation devices, in particular to a chip box pick-and-place mechanism and a semiconductor wet process soaking tank shaking device. Background technique [0002] As semiconductors enter the micro-nano era, greater challenges are posed to the semiconductor manufacturing process. In the traditional semiconductor wet etching preparation process, in order to meet the requirements of other processes such as the uniformity of semiconductor wafer corrosion, it is necessary to The sheet and the sheet box of the reaction solution are subjected to certain orderly mechanical vibrations to ensure corrosion uniformity and reaction rate. [0003] However, the structure of semiconductor wet etching process equipment in the prior art is generally more complicated, especially the process of taking and placing the cassette is more troublesome, often requiring manual unlocking or manual locking ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/67086H01L21/677
Inventor 李元升黄鑫亮夏楠君吴娖王勇威张伟锋吴光庆陈苏伟
Owner BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC
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