Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Manufacturing method of light emitting device

A light-emitting device and a manufacturing method technology, which are applied to components of lighting devices, semiconductor devices of light-emitting elements, lighting devices, etc., and can solve problems such as inability to directly connect to AC mains, lower production efficiency, yield rate, and high manufacturing difficulty. , to achieve the effect of low processing difficulty, reduce the difficulty of stamping, and low cost

Active Publication Date: 2021-01-08
ZHONGYANG OPTOELECTRONICS CO LTD
View PDF10 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] 1. High manufacturing difficulty, which reduces production efficiency and yield rate;
[0008] 2. The reliability is poor, the fixation between the plastic and the electrode is unstable, and there will be loosening
[0010] The granular structure itself only has LED chips that work with DC power, and cannot be directly connected to the AC mains. If the mains needs to be used, it is necessary to configure rectification, current control and voltage control modules, which increases the cost accordingly.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method of light emitting device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] figure 1 A flow chart of the manufacturing method of the light-emitting device according to Embodiment 1 of the present invention is schematically given, as shown in figure 1 As shown, the manufacturing method of the light emitting device includes the following steps:

[0040] (A1) Obtain a base for a light source, the base has a first part and a second part that are isolated from each other, and the first part and the second part are connected by insulating plastic; the way to obtain the base for a light source is:

[0041] (B1) Provide a carrier, the carrier includes a strip-shaped conductor, and the strip-shaped conductor has a plurality of bearing units distributed in a matrix; the carrier includes:

[0042] A strip-shaped conductor, the strip-shaped conductor has a plurality of carrying units distributed in a matrix; the carrying unit includes:

[0043] The first part, one end of the first part that is away from the extending direction of the strip-shaped conduct...

Embodiment 2

[0076] An application example of the method for manufacturing a light emitting device according to Embodiment 1 of the present invention.

[0077] In the carrier of this application example, the strip-shaped conductor has carrying units distributed in a matrix; along the extending direction of the strip-shaped conductor, a third connecting portion is provided between adjacent first connecting portions, The width of the first connecting portion is greater than the width of the third connecting portion; the second connecting portion extends along the extending direction; in the extending direction, the first connecting portion and the third connecting portion are shared, such as the first connecting portion distributed sequentially The bearing unit, the second bearing unit and the third bearing unit, the second part of the first bearing unit and the first part of the second bearing unit share the first connection part, the second part of the second bearing unit and the first part...

Embodiment 3

[0091] An application example of the method for manufacturing a light emitting device according to Embodiment 1 of the present invention.

[0092] The difference with embodiment 2 is:

[0093] 1. There is a through hole at the connection part between the first connecting part and the first part, and the first (through) hole on the through hole and the first part both extends along a direction perpendicular to the extending direction of the strip conductor, and the through hole The length and the width of the hole are larger than the first (through) hole on the first part; part of the through hole is the same as the through hole;

[0094]2. There is a through hole in the third connecting part, the width of the through hole along the extending direction is greater than the width of the connecting part between the third connecting part and the second connecting part, the through hole and the second part The second (through) holes extend along a direction perpendicular to the ex...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method for manufacturing a light-emitting device. The method for manufacturing the light-emitting device comprises the steps of: (A1) obtaining a base for a light source, wherein the base is provided with a first portion and a second portion that are isolated from each other, the first portion and the second portion are connected by an insulating plastic; (A2) electricallyconnecting a first electrode of the light source to the exposed first portion, electrically connecting a second electrode to the second portion, wherein an electrical device is disposed on the firstportion and / or the second portion, and electrically connecting an external power source connected through the first part or the second part to the light source after being rectified and controlled bythe electrical device; (A3) coating the light source, the electrical device, the first part and the second part with glue. The method has the advantages of simple structure, automation and the like.

Description

technical field [0001] The present invention relates to a light emitting device, in particular to a method for manufacturing the light emitting device. Background technique [0002] As a new light source with low power consumption and high brightness, LED chips have been widely used in the field of lighting. [0003] As the carrier of LED chips, there are currently many ways: [0004] 1. Plate structure, multiple LED chips are fixed on a transparent or opaque substrate, and the substrate is an elongated strip or rectangular structure; [0005] 2. Particle structure, the carrier adopts the structure of plastic-wrapped electrodes, the LED chip is fixed on the two electrodes, and the two electrodes are connected to the external power supply. A plurality of particle-structured carriers with LED chips are connected in series to form a high-power lamp, such as a spotlight. [0006] For large-scale production, the current granular structure uses scaffolds, which have many disadv...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): F21K9/235F21K9/238F21V21/002F21Y115/10
CPCF21V21/002F21K9/235F21K9/238F21Y2115/10
Inventor 陈广明
Owner ZHONGYANG OPTOELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com