Flexible electronic device and manufacturing method thereof

Abstract

The invention provides a flexible electronic device and a fabrication method thereof. The flexible electronic device comprises a first flexible substrate, wherein a circuit and a first runner are arranged on the first flexible substrate, the first runner extends along a wriggling shape, and the first runner is filled with a non-Newtonian fluid. By the flexible electronic device, the bending performance is ensured, and relatively good impact-resistant capability can be provided for the circuit.

Description

technical field [0001] The invention relates to the field of flexible technology, in particular to a flexible electronic device and a method for manufacturing the flexible electronic device. Background technique [0002] As the core technology of future personalized wearable medical equipment, flexible electronics has received extensive attention and support from all sides. Flexible electronic devices (including circuits, sensors, electrodes, chips, etc.) have the advantages of good skin affinity, stretchability, and bendability as devices. At present, the demand for flexible electronic devices is not satisfied with functions such as bendable and stretchable. The research on flexible substrate materials is also an important part of the field of flexible electronics. [0003] The characteristics of the current flexible substrate materials are stretchable, bendable, uniform force distribution and no directionality. This characteristic leads to the consistent force distributio...

AI Technical Summary

Problems solved by technology

[0003] The characteristics of the current flexible substrate materials are stretchable, bendable, uniform force distribution and no directionality. This characteristic leads to the consistent force distribution of electronic devices and wires, which can straighten the flexible substrate and flexible wires. No fracture will occur under the condition of a large range of deformation, but the flexible circuit in the flexible electronic device will be damaged in a small range of deformation

This situation leads to the fact that under the action of external force, the flexible circuit is saturated and the stretching performance of the wire has not yet been exerted.

Secondly, under the impact of external force, the flexible circuit is thicker than the wire. First, it can withstand more impact force, but the relative energy absorption capacity of the flexible circuit is relatively poor, and it is easy to break and fail under the impact of external force.

In the prior art, in order to ensure that the flexible circuit is not damaged under impact, it is necessary to make a thicker flexible protective layer, which increases the thickness of the flexible electronic device on the one hand, and on the other hand affects the bending performance of the flexible electronic device. make an impact

Therefore, the property that flexible circuits are prone to breakage under impact has become a major factor limiting the development of flexible electronics.

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