Cooling piece for circuit board and display panel employing cooling piece

Abstract

The invention discloses a cooling piece for a circuit board and a display panel employing the cooling piece. The cooling piece for the circuit board comprises a cooling piece body, wherein the coolingpiece body is provided with a plurality of cooling cavities which are arranged at intervals, the cooling cavities are used for accommodating a working medium, arbitrary one of the plurality of cooling pieces communicates with at least one of the remaining cooling cavities by a flowing passage, and each cooling cavity is provided with a condensation end and an evaporation end. According to the cooling piece for the circuit board, disclosed by the embodiment of the invention, no any circulation device is needed to be connected, the package flow of a chip is not affected, production and application are facilitated, self circulation of a refrigerating agent can be achieved without testing the heating state of each chip, and self-matching and self-balancing of cooling effects of different chips can be achieved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic products, in particular to a heat dissipation element for a circuit board and a display panel using the same. Background technique [0002] In related technologies, the current heat dissipation design of large-scale semiconductor display panels (such as TV) focuses on the heat dissipation of the whole system. However, with the continuous increase of display panel size and the continuous shrinking of TCON board (logic board) size, logic The heat dissipation of the board has become a problem that must be considered in the future, otherwise it may cause poor operation of the logic board. At present, the components with high temperature on the TCON board are generally chip devices, including TCON main control chips, PMIC chips, and P-gamma chips. In this way, when the TCON board is working, the temperatures of multiple chips are high and multiple hot spots are formed, so it is ...

AI Technical Summary

Problems solved by technology

[0004] The above-mentioned heat dissipation device has the following defects: 1) an external liquid circulation device, such as an electronic pump, is required to promote the active circulation of the working medium liquid, which not only has high cost, but also has a large volume and takes up space; 2) the heat dissipation effect of the chip near the front end of the microchannel is the best. Good, but the chips near the end of the microchannel are the worst at dissipating heat

[0005] In addition, the existing multi-chip heat sink usually introduces a multi-chip heat dissipation packaging structure at the chip packaging stage, or adopts a multi-layer chip stacking method for heat dissipation. Although these can play a role in heat dissipation, they need to change the front-end chip packaging manufacturing. Process, the production process is cumbersome, and the heat dissipation of each chip is independent of each other, and the heat dissipation effect is not balanced

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