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Display panel and display device

A technology for display panels and display areas, which is used in the manufacture of electrical components, electrical solid-state devices, and semiconductor/solid-state devices. It can solve problems such as corrosion damage, improve packaging reliability, reduce the risk of wire breakage, and solve edge overflow. conditions and the effect of glitches

Active Publication Date: 2019-04-05
XIAMEN TIANMA MICRO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because OLED devices will be corroded and damaged under the action of water vapor and oxygen, it is particularly important to choose a better packaging method for OLED devices.

Method used

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  • Display panel and display device

Examples

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Embodiment Construction

[0038] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0039] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0040] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0041] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention describes a display panel and a display device. The display panel comprises a substrate, a display function layer, a thin film encapsulation layer, at least one retaining wall and at least one groove, wherein the substrate is provided with a display area and a non-display area; the display function layer is located on the substrate, and the display function layer comprises at least one inorganic insulating layer; the thin film encapsulation layer is located on one side of the display function layer away from the substrate, and the thin film encapsulation layer comprises at leastone organic layer and at least one inorganic layer; the at least one retaining wall is located in the non-display area and on the same side as the display function layer, and the inorganic layer at least covers the retaining wall; the at least one groove is located on one side of the inorganic insulating layer away from the substrate and is arranged in the non-display area between the retaining wall and the display area, the groove accommodates the organic layer, the vertical projection of the groove on the substrate has different widths in the first direction, and the first direction is a direction that the display area points to the non-display area. According to the scheme of the invention, the risk of disconnection caused by forming touch electrode lines on the retaining wall and the risk of cracking caused by film layer peeling can be reduced, and the reliability of encapsulation can be improved.

Description

technical field [0001] The present invention relates to the field of display technology, and more specifically, to a display panel and a display device. Background technique [0002] OLED (Organic Light Emitting Diode, Organic Light Emitting Diode) display is a self-luminous display. Compared with LCD (Liquid Crystal Display, Liquid Crystal Display), OLED display does not require a backlight source, so OLED display is thinner and lighter. In addition, OLED display is also Due to the advantages of high brightness, low power consumption, wide viewing angle, high response speed, and wide operating temperature range, it is increasingly used in various high-performance display fields. However, since the OLED device will be corroded and damaged under the action of water vapor and oxygen, it is particularly important to select a better packaging method for the OLED device. [0003] At present, thin-film encapsulation is a widely used encapsulation method in the manufacture of OLED...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52
CPCH10K50/844
Inventor 李家欣沈鹏冷传利柳家娴
Owner XIAMEN TIANMA MICRO ELECTRONICS
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