Wafer cutting method

Abstract

The invention discloses a wafer cutting method, comprising the following steps: providing a wafer, attaching a grinding adhesive film layer on the front surface of the wafer, grinding the back of the wafer attached with the grinding adhesive film layer, and Attach an adhesive film layer on the back of the ground wafer, and fix the ground wafer on the wafer frame through the adhesive film layer, remove the grinding adhesive film layer on the front side of the wafer, and use laser to pre-process along multiple longitudinal lines. Cutting marks and a plurality of transverse pre-cut marks are first cut to the back of the wafer, and the wafer is continuously cut along the depth direction of each of the plurality of longitudinal first cutting lines and the plurality of transverse first cutting lines by using a cutting tool, and the longitudinal first cutting lines The width of a cutting line is greater than the width of the second longitudinal cutting line, and the width of the first transverse cutting line is greater than the width of the second transverse cutting line. The wafer cutting method disclosed in the present invention is used in the ultra-thin wafer cutting process, not only provides an ultra-thin wafer cutting process, but also improves the wafer cutting yield.

Description

technical field [0001] Embodiments of the present invention relate to the field of semiconductor manufacturing, and in particular, to a wafer cutting method. Background technique [0002] Integrated circuit chips continue to develop in the direction of high density and thinness. In order to meet the requirements, it is necessary to thin and cut the back of the wafer. Wafer thinning technology is the key technology of stacked chip packaging. As the number of chip stacking layers continues to increase, the thickness of the chip is gradually thinning. [0003] The traditional process of thinning and cutting wafers (60um~100um thickness) is five process steps: front-side filming, back-side grinding, back-side filming, front-side peeling and wafer cutting. The cutting tool used in the wafer cutting process is a blade, but when processing thinner original wafers (less than 60 μm in thickness), because the wafer is thinned, its strength is also weakened, and defects such as fronta...

AI Technical Summary

Problems solved by technology

However, using a mechanical blade to directly act on the wafer surface will cause stress damage to the inside of the crystal, which is prone to wafer edge chipping and crystal damage.

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