Semiconductor chip packaging method

A chip packaging and packaging method technology, applied in semiconductor devices, electric solid state devices, radiation control devices, etc., can solve the problems of easy access to the chip, easy detachment of glue, poor photosensitive effect of the chip, etc., to reduce dust-free requirements, reduce The effect of light refraction and improved photosensitive effect

Inactive Publication Date: 2019-03-29
NANTONG FUJITSU MICROELECTRONICS
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  • Claims
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Problems solved by technology

[0003] The inventors of the present application have discovered during long-term research that, on the one hand, since the thickness of the transparent glass cover plate is generally thick, refraction, reflection and energy loss will occur when the light passes through the transparent glass, which will make the photosensitive effect of the chip worse; On the other hand, the transparent glass cover and the chip are connected by glue. After a long time of use, the glue is easy to fall off, and the external dust is easy to enter the photosensitive area of ​​the chip, which will affect the photosensitive effect of the chip.

Method used

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  • Semiconductor chip packaging method
  • Semiconductor chip packaging method
  • Semiconductor chip packaging method

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0025] see figure 1 , figure 1 It is a schematic flow chart of an embodiment of the semiconductor chip packaging method of the present application, the packaging method comprising:

[0026] S101: Provide a chip. The chip includes a front side and a back side. The front side of the chip is provided with a photosensitive area and a plurality of pads located around the photosensitive area. A transparent protective layer is formed on the front side of the chip. ...

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Abstract

The invention discloses a semiconductor chip packaging method. The method includes the steps: providing a chip, wherein the chip includes the front surface and the back surface, and the front surfaceof the chip is provided with a photosensitive area and bonding pads located around the photosensitive area; forming a transparent protective layer on the front surface of the chip, wherein the transparent protective layer covers the photosensitive region of the chip and the bonding pads; forming through holes in the back surface of the chip, and enabling the bonding pads to be exposed out of the through holes; enabling the bonding pads of the chip to be electrically connected with a circuit board through the through holes. Through the above manner, the method can improve the light sensing effect of the chip.

Description

technical field [0001] The present application relates to the technical field of semiconductors, in particular to a semiconductor chip packaging method. Background technique [0002] A chip with a photosensitive area is a very important part of an imaging device. In order to protect the photosensitive area of ​​the chip, a commonly used packaging method includes: adding a transparent glass cover above the photosensitive area of ​​the chip to protect the photosensitive area of ​​the chip. [0003] The inventors of the present application have discovered during long-term research that, on the one hand, since the thickness of the transparent glass cover plate is generally thick, refraction, reflection and energy loss will occur when the light passes through the transparent glass, which will make the photosensitive effect of the chip worse; On the other hand, the transparent glass cover and the chip are connected by glue. After a long time of use, the glue is easy to fall off, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146
CPCH01L27/14685H01L27/1469
Inventor 俞国庆
Owner NANTONG FUJITSU MICROELECTRONICS
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