Method and device for laser processing chip

Abstract

The invention provides a laser processing chip method and device. The laser processing chip method comprises the following steps that a laser device and an optical element is used for building a laserprocessing system; the processing deviation of the constructed laser processing system is detected; drawing parameters of the groove to be processed is obtained according to the processing deviationamount; and the laser processing system is used for processing the refrigeration type infrared detection chip according to the drawing parameters of the groove to be processed, so that a closed annular groove is formed between the pixel layer and the edge on the refrigeration type infrared detection chip. According to the laser processing chip method and device, the pixel utilization rate at the corner of the closed annular groove can be effectively improved, the influence on the width and the depth uniformity of the groove at the corner is reduced, and finally the effect of the laser groovingand the reliability of the chip are improved.

Description

technical field [0001] The invention relates to the technical field of laser micromachining, in particular to a method and device for laser machining chips. Background technique [0002] Infrared detectors have been well used in both civil and military applications, and the performance of cooled infrared detectors is particularly excellent. The infrared detection chip in the cooling type infrared detector is often in an environment with drastic temperature changes. In order to ensure its normal working performance, the infrared detection chip in the detector needs to be cooled with liquid nitrogen during the working state. The temperature at this time is about It is -200°C, but during non-working hours, the infrared detection chip is exposed to the atmospheric temperature. For example, the highest temperature in the desert can sometimes reach about 70°C, so the ambient temperature of the infrared detection chip is between -200°C and Constantly changing between 70°C. [000...

AI Technical Summary

Problems solved by technology

The advantages of this method: simple operation, low equipment requirements, and good etching selectivity; disadvantages: first, a photolithography process is required for each chip, which is time-consuming and laborious; Liquid, complex corrosion process, low precision, easy to damage the bottom readout circuit

The advantages of dry etching: the first etching selectivity and anisotropy are good, the second etching pattern can be precisely controlled and the resolution is high; the disadvantages: first, a single chip needs to be photolithography, which is time-consuming and laborious, and the second is damage Bottom readout circuit

[0007] At the same time, in the prior art, when the galvanometer is used to control the relative movement of the laser spot and the detector chip through the laser grooving method, due to the limitation of the galvanometer control method, when the square-shaped grooving is performed to form a closed annular groove, the corner There will be an arc at the corner, resulting in uneven depth and width of the groove at the corner, and affecting the area of ​​the effective pixel area

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