Brand new rivet suitable for PCB circuit board riveting and manufacturing process thereof

A technology of PCB circuit board and manufacturing process, which is applied in the direction of rivet, application, thin plate connection, etc., to achieve the effects of reducing manpower, strong positioning support, and solving scrapping

Active Publication Date: 2019-03-22
昆山敏欣电子有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a new rivet for PCB circuit board riveting and its manufacturing process in view of the above-mentioned deficiencies in the prior art. The inner short scrapping caused by rivet chipping and the scrapping caused by layer deviation caused by rivet deformation can reduce manpower and material costs

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  • Brand new rivet suitable for PCB circuit board riveting and manufacturing process thereof

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Embodiment Construction

[0015] The specific embodiment of the present invention is further described below in conjunction with accompanying drawing:

[0016] A brand-new rivet and its manufacturing process for PCB circuit board riveting, characterized in that: the rivet is an inverted "T" structure, the center of the rivet is provided with a counterbore, and the bottom flange of the rivet is The disc diameter D1 is 2.0-8.0 mm, the height H1 of the flange plate at the bottom of the rivet is 0.1-1.0 mm, the small diameter of the central counterbore hole of the rivet D2 is 0.5-4.0 mm, and the major diameter of the central counterbore hole of the rivet is D3 The outer diameter D4 of the upper end of the rivet is 1.5-5.0mm, and the distance H2 between the large-diameter bottom surface of the central counterbore of the rivet and the top surface of the flange at the bottom of the rivet is 0.1-10.0mm. The distance H3 between the top surface of the rivet and the large-diameter bottom surface of the central co...

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Abstract

The invention discloses a brand new rivet suitable for PCB circuit board riveting and a manufacturing process thereof. The rivet is characterized in that the rivet is of an inverted-T structure, a sinking hole is formed in the center of the rivet, the diameter D1 of a bottom flange disc of the rivet ranges from 2.0 to 8.0 mm, the height H1 of the bottom flange disc of the rivet ranges from 0.1 to1.0 mm, the small diameter D2 of the sinking hole in the center of the rivet ranges from 0.5 to 4.0 mm, the large diameter D3 of the sinking hole in the center of the rivet ranges from 1.0 to 4.5 mm,the outer diameter D4 of the upper end of the rivet ranges from 1.5 to 5.0 mm, the distance H2 between the large-diameter bottom face of the sinking hole in the center of the rivet and the top face ofthe bottom flange disc of the rivet ranges from 0.1 mm to 10.0 mm, and the distance H3 between the top face of the rivet and the large-diameter bottom face of the sinking hole in the center of the rivet ranges from 0.3 to 6.0 mm. The rivet has the advantages that scraps do not fall off, and layer deviation is avoided, the problem that in the riveting process, scrapping is caused by inner short scrapping caused by rivet scrap falling and layer deviating caused by rivet deforming can be solved, and manpower and material cost can be reduced.

Description

technical field [0001] The invention belongs to the technical field of rivets, and in particular relates to a brand-new rivet used for riveting of PCB circuit boards and a manufacturing process thereof. Background technique [0002] At present, when the existing rivets are used for riveting multi-layer circuit boards, on the one hand, they are prone to chipping, which leads to a short circuit in the circuit board due to chipping, which leads to the scrapping of the circuit board; scrapped. Therefore, the operating efficiency is greatly reduced, the production cost is increased, and the product quality is reduced. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a new rivet for PCB circuit board riveting and its manufacturing process in view of the above-mentioned deficiencies in the prior art. The inner short scrap caused by rivet chipping and the scrap caused by layer deviation caused by rivet deformation can r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C65/60F16B19/08F16B5/04B29L31/34
CPCB29C65/602B29L2031/3425F16B5/04F16B19/08
Inventor 庄召国张远武
Owner 昆山敏欣电子有限公司
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