Copper clip stacking chip structure and packaging method thereof

Abstract

The invention relates to a copper clip stacking chip structure and a packaging method thereof. The copper clip stacking chip structure comprises a lead frame, a first chip, a second chip, a first copper clip, a second copper clip and a molding material. The first chip is fixed to the lead frame by a first welding material; the first copper clip is fixed on the lead frame and / or the first chip by the first welding material; the second chip is fixed to the first copper clip by a second welding material; and the second copper clip is fixed on the second chip by the second welding material. The solder melting temperature of the first welding material is greater than that of the second welding material. According to the invention, the copper clip connection mode is applied to the stacked chip;different stacked chips are connected by stacked copper clips to realize connection of the stacked chips and the lead frame, so that the requirements of high power and high current are met. The copperclip stacking chip structure has advantages of low power consumption and high heat dissipation efficiency. The size of the packaged product is reduced and the product output and yield are improved.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a copper clip stacked chip structure and a packaging method thereof. Background technique [0002] The packaged chip products in the prior art basically connect the chip and the lead frame through various metal wires. This metal wire welding method has the disadvantages of low current and poor heat dissipation, and it is difficult to meet the requirements of high power and high current. For For some complex chip stacking products, the current metal wire connection method cannot meet these requirements and needs to be improved. Contents of the invention [0003] The purpose of the present invention is to provide a copper clip stacked chip structure and its packaging method, which makes up for the shortcomings of low current and poor heat dissipation of traditional metal wire connections, and can be widely used in high power, high current, low power consumption, and high h...

AI Technical Summary

Problems solved by technology

[0002] The packaged chip products in the prior art basically connect the chip and the lead frame through various metal wires. This metal wire welding method has the disadvantages of low current and poor heat dissipation, and it is difficult to meet the requirements of high power and high current. For For some complex chip stacking products, the current metal wire connection method cannot meet these requirements and needs to be improved

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