Surface polishing device for integrated circuit copper clad laminate

Abstract

The invention discloses a surface polishing device for an integrated circuit copper clad laminate, and the device includes a base, two brackets, two conveying devices and a support plate, the two brackets are fixedly connected with the upper end of the base, the two conveying devices are fixedly connected with the brackets, and the support plate is fixedly connected with the middle part of the upper end of the base. The copper clad laminate does not need to be manually placed on the polishing device one by one in the polishing process through the conveying devices, so that the labor can be saved, the labor cost can be reduced, and the working efficiency can be improved. Through the cooperation of a reciprocating screw rod and a polishing sleeve, the surface of the copper clad laminate canbe completely polished, so as to avoid polishing dead corners and improve the polishing effect. The copper clad laminate is firmly sucked by a suction cup to achieve a fixing function, and at the sametime, the copper clad laminate is fixed before polishing through the cooperation of a clamping device, so that sliding during polishing is avoided and the polishing effect is guaranteed.

Description

technical field [0001] The invention relates to the field of new generation information technology, in particular to a surface grinding device for an integrated circuit copper clad laminate. Background technique [0002] In the production process of existing integrated circuit boards, double-sided circuit boards are the most widely used. The board material used in the production of double-sided circuit boards is generally copper-clad laminates, and it is often necessary to polish off the oxide substances on the surface of copper-clad laminates before transferring. , while the existing copper-clad laminates are polished by manual grinding, the grinding effect is poor, and then artificially use a flat file or gauze to polish the surrounding smoothness and remove burrs. The manual grinding method has the following defects when this double-sided circuit board is made: artificial The grinding force is uneven, the grinding flatness is poor, the grinding speed is slow, and the grin...

AI Technical Summary

Problems solved by technology

[0002] In the production process of existing integrated circuit boards, double-sided circuit boards are the most widely used. The board material used in the production of double-sided circuit boards is generally copper-clad laminates, and it is often necessary to polish off the oxide substances on the surface of copper-clad laminates before transferring. , while the existing copper-clad laminates are polished by manual grinding, the grinding effect is poor, and then artificially use a flat file or gauze to polish the surrounding smoothness and remove burrs. The manual grinding method has the following defects when this double-sided circuit board is made: artificial The grinding force is uneven, the grinding flatness is poor, the grinding speed is slow, and the grinding effect is poor

[0003] The Chinese document is CN207118085U, a double-sided circuit board surface grinding device. The utility model can solve the problems of uneven manual grinding force, poor grinding flatness, slow grinding speed and poor grinding effect in the manual grinding method during double-sided circuit board production. Difficult problem, it can realize the function of fully automatic conversion and grinding of double-sided circuit boards, without manual operation, and has the advantages of uniform grinding force, good grinding flatness, fast grinding speed and good grinding effect, but this device still needs manual placement, and the processing efficiency Low, and there are grinding dead angles in grinding at the same time, and the grinding effect is poor. Therefore, a surface grinding device for integrated circuit copper clad laminates is proposed.

Images