High-thermal conductivity nylon compound material

Abstract

The invention relates to the field of high-polymer compound materials, and provides a high-thermal conductivity nylon compound material. , which is prepared from the following Raw raw material components include: nylon resin, an enhancing material, a thermal conductivity material and a lubricant, wherein the nylon resin is prepared fromcomprises at least one graphene-containing PA6 resin. The high-thermal conductivity nylon compound material has the following advantages and beneficial effects that the problem of extrusion flying dust caused by small graphene stacking density is solved; graphene in the graphene-containing PA6 resin and a conventional thermal conductivity filler can be organically combined, to generate an unexpected synergistic effect is generated, and so that the technicalbottleneck problem that a conventional thermal conductivity material cannot reach a high thermal conductivity coefficient under awith low loading degree of the thermal conductivity filler is solved; the nylon compound material can be endowed with good thermal conductivity performance by introducing only a small amount of graphene (0.1%-2%) needs to be introduced into a conventional thermal conductivity filler and filledfilling nylon compound material system so that the nylon compound material can be endowed with good thermal conductivity performance, compared with using graphene powder directly, the high-thermal conductivity nylon compound material has the advantages that the adding amount of the graphene is effectively reduced, the production cost is greatly reduced, and large-scale industrial production is feasible.

Description

technical field [0001] The invention relates to the field of polymer composite materials, in particular to a graphene-containing nylon composite material with high thermal conductivity. Background technique [0002] In recent years, with the rapid development of high-power electronic and electrical products, there will inevitably be more and more problems such as product heat generation, resulting in reduced product efficacy and shortened service life. Some data show that the reliability of electronic components decreases by 10% for every 2°C increase in temperature; the life at 50°C is only 1 / 6 of that at 25°C. In order to ensure that electronic components can work normally for a long time, it is key to transfer the generated heat in time. Traditional thermal conductive materials are mostly metals and metal oxides, as well as other non-metallic materials, such as graphite, carbon black, AlN, etc. With the development of science and technology and production, many products...

AI Technical Summary

Problems solved by technology

However, mixing with other powder components of the formulation components in the form of high-concentration slurry greatly increases the mixing resistance, and there is a risk of uneven dispersion of other components, and the thermal conductivity of the thermally conductive plastic prepared by this method is still relatively low. Low, the amount of graphene is up to 30%, and 10% of thermal conductive powder additives (alumina, silicon carbide) are added, and the thermal conductivity is only 4W·m -1 ·K -1

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