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A high-temperature pressure sensor back-end packaging structure and a packaging method

A pressure sensor and high-temperature technology, applied in the direction of microstructure devices, manufacturing microstructure devices, microstructure technology, etc., can solve problems such as heat failure, failure to work normally, unreasonable structure, etc., to reduce heat conduction, prevent oxidation failure or damage External interference, reduce the effect of heat conduction

Active Publication Date: 2019-01-25
ZHONGBEI UNIV
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Problems solved by technology

[0005] The purpose of the present invention is to solve the problem that the high-temperature pressure sensor cannot work normally due to its unreasonable structure in the harsh service environment, and provides a back-end packaging structure and packaging method of the high-temperature pressure sensor to obtain High-temperature sensor back-end packaging structure with good thermal insulation performance and effective protection of back-end components to work normally

Method used

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  • A high-temperature pressure sensor back-end packaging structure and a packaging method
  • A high-temperature pressure sensor back-end packaging structure and a packaging method

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Embodiment Construction

[0030] In order to enable those skilled in the art to better understand the present invention, the present invention will be further clearly and completely described below in conjunction with reference to the accompanying drawings and in conjunction with embodiments. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0031] Such as figure 1 As shown, a back-end packaging structure of a high-temperature pressure sensor includes a threaded connector 2, a cylindrical shell 1, a cable fixing head 3 and a fastening nut 4 assembled on the same axis in sequence, the threaded connector 2, the cable fixing Both the head 3 and the fastening nut 4 are provided with axial through holes; the middle part of the cylindrical shell 1 is a through inner cavity, and the shell wall of the cylindrical shell 1 is designed as a vacuum interlayer, and one end of the interlayer is open ...

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Abstract

The invention relates to a high-temperature pressure sensor back-end packaging structure and a packaging method, which solves the problem that the high-temperature pressure sensor cannot work normallydue to heating failure in a high-temperature environment due to unreasonable structure under a harsh service environment. The invention comprises a cylindrical shell with a sandwich, the sandwich isfilled with a heat radiation protection material, one end of the cylindrical housing is provided with a threaded connector, The other end of the cylindrical housing is provided with a cable fixing head and a fastening nipple; a nano-porous gas gel with a conductor through hole is arranged in a cylindrical shell and the cable fixing head, the fastening nipple is encapsulated with a conductor connector extending into the conductor through hole, and the tungsten pin and the conductor bonding joint are encapsulated in the interconnecting head. The invention has the advantages of reasonable structure, good heat dissipation performance of the shell and tube, stable and reliable operation of the internal circuit protection, and meets the requirement of pressure measurement of the pressure sensorunder the high temperature environment.

Description

technical field [0001] The invention relates to the technical field of packaging of high-temperature pressure sensors, in particular to a back-end packaging structure of a high-temperature pressure sensor and a packaging method thereof. Background technique [0002] The high-temperature pressure sensor is a sensor that measures the pressure of various gases and liquids in a high-temperature environment. It is widely used in various industrial self-control environments. It is mainly used to measure the pressure in boilers, pipelines, high-temperature reaction vessels, and downhole pressure. And various engine cavity pressure, high temperature oil level and detection, oil well pressure measurement, etc. [0003] However, a prominent problem faced by high-temperature pressure sensors is that if the front-end working environment of the high-temperature pressure sensor is at a high temperature, a large amount of heat will be transmitted along the direction of the sensor, which wi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/00B81C1/00
CPCB81B7/0032B81B7/0058B81C1/00261
Inventor 王宇刘雅鑫杨强刘晓娜许凯毛红奎侯击波党惊知徐宏
Owner ZHONGBEI UNIV
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