Resin tile leftover material cutting device

Abstract

The invention relates to a resin tile leftover material cutting device. The resin tile leftover material cutting device comprises a support. The support is provided with a cutting roll. The cutting roll is mounted on the support. The cutting roll is of a hollow structure. A heating roll is arranged above the cutting roll. The left and right ends of the heating roll are both sleeved with supportingblocks. End covers are mounted on the supporting blocks at the two ends of the heating roll correspondingly. A connecting sleeve is mounted on each end cover. A heater is arranged in the heating rollin a penetrating mode. The two ends of the heater are both connected with power lines. The cutting roll comprises a cutting roll shaft. The left end of the cutting roll shaft is provided with a firstconnecting shaft. The right end of the cutting roll shaft is provided with a second connecting shaft. A cone body is arranged in the cutting roll shaft. The cone body is provided with conical bearingbushes. The cone body is sleeved with the conical bearing bushes through a tension spring. Cutters are fixed to the conical bearing bushes. A first adjusting screw is mounted on the first connectingshaft in a penetration mode, and a second adjusting screw is mounted on the second connecting shaft in a penetration mode. The resin tile leftover material cutting device increases the cutting speed.

Description

technical field [0001] The invention relates to a device for cutting resin tile scraps, belonging to the technical field of cutting equipment. Background technique [0002] In the production process of resin tiles, some scraps need to be cut off. The trimmed scraps are continuous long strips, which need to be cut into segments for further processing and use. Currently, the commonly used resin tile cutting machine is in the form of knife cutting. Once After the resin tile solidifies and hardens, it cannot be cut. Contents of the invention [0003] According to the deficiencies in the prior art above, the technical problem to be solved by the present invention is to provide a device for cutting resin tile scraps, which heats the resin tile scraps before cutting to facilitate cutting. [0004] The device for cutting resin tile leftovers according to the present invention includes a vertically arranged bracket, which is characterized in that: a cutting roller is horizontally ...

AI Technical Summary

Problems solved by technology

[0002] In the production process of resin tiles, some scraps need to be cut off. The trimmed scraps are continuous long strips, which need to be cut into segments for further processing and use. Currently, the commonly used resin tile cutting machine is in the form of knife cutting. Once Resin tiles will not be able to be cut after solidification and hardening

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