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High-toughness and low-resistivity silver-gold alloy bonding wire

A technology of silver-gold alloy and low resistivity, which is applied in the field of silver-gold alloy bonding wire, can solve the problems of low strength and high price, achieve low cost, reduce material cost, and improve mechanical strength and processability

Active Publication Date: 2019-01-11
CHONGQING MATERIALS RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, gold has the disadvantages of high price, low strength, and brittle intermetallic compounds at the interface with aluminum disks. In order to improve the performance of bonding wires and reduce production costs, relevant institutions in various countries have developed alternative new gold-silver-based alloy bonding wires. Extensive research and application development make it an ideal material to replace gold wire

Method used

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  • High-toughness and low-resistivity silver-gold alloy bonding wire

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Example 1: Ag content is 99.4%, Ce content is 0.005%, Cu content is 0.001%, and the rest is Au;

Embodiment 2

[0017] Example 2: Ag content is 85%, Ce content is 0.01%, Cu content is 0.05%, Pd content is 0.01%, Ca content is 0.0005%, and the rest is Au;

Embodiment 3

[0018] Embodiment 3: the Ag content is 95%, the Ce content is 0.005%, the Cu content is 0.005%, the Be content is 0.005%, and the rest is Au;

[0019] The above-mentioned gold purity is ≥99.995% high-purity gold, the silver purity is ≥99.999% high-purity silver, and the purity of other elements is ≥99.99%.

[0020] Get each component described in embodiment 1-3, prepare the silver-gold alloy bonding wire of high strength toughness, low resistivity respectively according to the following method:

[0021] 1) High vacuum medium frequency induction melting:

[0022] Put Au and part of Ag (the amount of Ag is less than half of the total amount) in a high-vacuum medium-frequency melting furnace for master alloy melting. The melting temperature is 1100-1300°C, and the melting process is filled with high-purity argon. protection, refining and cooling for 10-30 minutes to obtain alloy ingots; processed into Ag / Au master alloy plates, cleaned for later use.

[0023] 2) High vacuum con...

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Abstract

The invention relates to a high-toughness and low-resistivity silver-gold alloy bonding wire. The high-toughness and low-resistivity silver-gold alloy bonding wire is prepared from the alloy components in percentage by weight: 80%-100.0% of Ag, 0%-20.0% of Au, and 0%-0.01% of two or more of Ce, Cu, Pd, Be, Mg and Ca which are minute in content. According to the high-toughness and low-resistivity silver-gold alloy bonding wire, the fracturing load is larger than 10 cN, meanwhile the elongation is larger than 18%, the mechanical property is adjustable and controllable, and the resistivity is smaller than 1.8 [mu]omega.cm; and the using cost of the silver-gold alloy bonding wire is lowered by 80% or above compared with the material cost of an existing bonding alloy wire, the mechanical property, the electrical property, oxidation resistance and the bonding property are excellent, and thus the high-toughness and low-resistivity silver-gold alloy bonding wire can be widely applied to the field of packaging.

Description

technical field [0001] The invention belongs to the field of alloys, in particular to a silver-gold alloy bonding wire with high strength and toughness and low resistivity. Background technique [0002] With the upgrading of advanced semiconductor packaging technology and the development of new electronic industries, bonding wire, one of the key basic materials for electronic packaging, requires miniaturization, high strength, and low cost, and at the same time meets the requirements of stable lead arc in the bonding process of integrated circuits. , high bonding fastness and high stability, excellent electrical conductivity and other comprehensive performance requirements. The resistivity of high-purity silver is 1.6μΩ•cm, the smallest resistivity among all metals, the best conductivity, and the heat dissipation of silver is better than that of gold, but pure silver wire is unstable in ball formation and easy to oxidize, so there is a big problem in its use. challenge. Th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C5/06H01L23/49
CPCC22C5/06H01L23/49H01L2224/48463
Inventor 唐会毅吴保安黄福祥郭卫民罗维凡刘庆宾李凤罗凤兰陈小军
Owner CHONGQING MATERIALS RES INST
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