Laser-assisted electrospray in-situ printing device

Abstract

The invention belongs to the technical field of advanced manufacture, and provides a laser-assisted electrospray in-situ printing device. The laser-assisted electrospray in-situ printing device comprises an electrospray printing module and a laser functional processing module; functional material ink of the electrospray printing module flows out from a spray needle mouth under the action of pressure, forms stable Taylor cone jet and ejects stable refined jet flow under an electro-hydrodynamic effect, and is ejected on a matrix to form a printing layer. The laser functional processing module isused for carrying out in-situ compounding on the printing layer so as to synchronously realize functional processing such as in-situ high-temperature curing and in-situ crystallization of a printingstructure. According to the device, functional structures and devices are directly realized on required matrixes, so that the secondary positioning error difficulties such as transfer printing, pasting and splicing of traditional methods are eliminated, the problems of weak binding force and low sensitivity caused by gluing process are avoided, the precision and binding strength of the printing structure are improved, the accuracy of printing micro-nano structures is ensured, and the in-situ functionalization of functional materials is realized.

Description

technical field [0001] The invention belongs to the field of advanced manufacturing technology, and in particular relates to a laser-assisted electrospray in-situ printing manufacturing device. Background technique [0002] With the integration and deep integration of advanced manufacturing technology, information technology and intelligent technology, high-end intelligent equipment continues to develop in the direction of modularization, integration, and intelligence. Therefore, intelligent equipment needs to integrate more sensors, drives, controls, etc. Functional structural units to meet specific functional requirements. [0003] In the fields of aviation, aerospace, medical treatment, and microelectronics, there are a large number of intelligent equipment components that need to integrate multiple discrete functional structural units to realize specific comprehensive functions. For example, deformed-wing aircraft can complete the deformation of the wing by integrating ...

AI Technical Summary

Problems solved by technology

Although these methods are simple and practical, there are still problems such as limited spatial layout accuracy, excessively large manufacturing scale of functional units, and weak bonding performance between functional units and substrates.

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