Uniformity control device for wafer production etching

Abstract

The invention relates to the technical field of semiconductor manufacturing accessories, and especially relates to a uniformity control device for wafer production etching, wherein the device achievesthe convenient clamping, and is easy for the control of the speed and quantity of solution. The device includes a workbench and a plastic dropper, and also comprises a first support bar, a second support bar, a front limiting plate, a rear limiting plate, a left baffle plate, a right baffle plate, a push rod, a rack, a rear incomplete gear, a front incomplete gear, a rear connecting rod, a frontconnecting rod, a front fixed rod and a rear fixed rod. The device further comprises a third supporting rod, a fourth supporting rod, a first rotating rod, a second rotating rod, a first threaded rod,an upper gear , a lower gear, a first connecting rod, a second connecting rod, a third connecting rod, a fourth connecting rod, a lantern ring, a left clamping plate and a right clamping plate, wherein the right side wall of the first supporting rod is provided with a first placement groove and a second placement groove, and the first placement groove and the second placement groove are respectively provided with a first ball bearing and a second ball bearing.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing auxiliary devices, in particular to a control device for uniformity of wafer production and etching. Background technique [0002] As we all know, the control device for the uniformity of wafer production etching is a device used in the semiconductor manufacturing process to use the chemical reaction between the solution and the pre-etching material to remove the part that is not masked by the masking film material. It has been widely used in the field of semiconductor manufacturing; the existing control device for the uniformity of wafer production etching includes a workbench and a glue dropper, and the glue dropper is located above the workbench; the existing When using the control device for the uniformity of wafer production etching, the user places the pre-etching material on the workbench, draws the solution with the rubber dropper, and then drops the solution to the pre...

AI Technical Summary

Problems solved by technology

[0002] As we all know, the control device for the uniformity of wafer production etching is a device used in the semiconductor manufacturing process to use the chemical reaction between the solution and the pre-etching material to remove the part that is not masked by the masking film material. It has been widely used in the field of semiconductor manufacturing; the existing control device for the uniformity of wafer production etching includes a workbench and a glue dropper, and the glue dropper is located above the workbench; the existing When using the control device for the uniformity of wafer production etching, the user places the pre-etching material on the workbench, draws the solution with the rubber dropper, and then drops the solution to the pre-etching through the rubber dropper. The material can be used; the existing control device for the uniformity of wafer production and etching is found to be inconvenient to clamp, and the convenience of use is poor; it is inconvenient to control the speed and amount of the solution, and the reliability of use is relatively low. Low

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