A lead frame tape cutting mechanism

Abstract

The invention relates to the field of semiconductor processing, in particular to a lead frame tape cutting mechanism, including a rack, the rack is provided with a feed cylinder arranged horizontally,one end of the feeding barrel communicates with a discharging barrel which is perpendicular to the feeding barrel and arranged transversely, the other end of the feeding barrel is slidably connectedwith a push rod, one end of the push rod is positioned in the feeding barrel, the other end of the push rod is positioned outside the feeding barrel, a tension spring is connected between one end of the pushing rod positioned outside the feeding barrel and the discharging barrel, the bottom and the top of the feeding barrel are provided with insertion holes, and the insertion holes on the top of the feeding barrel and the insertion hole on the bottom of the feeding barrel are staggered; pickup units are arranged above and below the feeding cylinder, a hot cutting knife opposite to the insertion hole is slidably connected to the frame, one end of the discharging cylinder is slidably connected with a discharging rod, one end of the discharging rod is positioned in the discharging cylinder, the other end of the discharging rod is positioned outside the discharging cylinder, and the other end of the discharging cylinder is provided with a collection box. The scheme prevents the semiconductor device from vibrating off the rack when the semiconductor device is cut.

Description

technical field [0001] The invention relates to the field of semiconductor processing, in particular to a lead frame tape cutting mechanism. Background technique [0002] A semiconductor refers to a material whose conductivity at room temperature is between that of a conductor and an insulator. Semiconductors have a wide range of applications in radios, televisions, and temperature measurement. Semiconductors are usually processed in large quantities during the processing process. After processing, the packaged products are cut through the rib cutting process, and the dams between the outer pins of the lead frame and the joints of the lead frame strips are cut off. [0003] At present, the cutting method of the lead frame tape is mostly manually holding the lead frame tape under the cutting knife, and then moving the cutting knife down to cut the lead frame tape. Since the volume of the semiconductor device is relatively small and the weight is relatively light, the cutting...

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Problems solved by technology

[0003] At present, the cutting method of the lead frame tape is mostly manually holding the lead frame tape under the cutting knife, and then moving the cutting knife down to cut the lead frame tape. Since the volume of the semiconductor device is relatively small and the weight is relatively light, the cutting knife When cutting semiconductor devices, the vibration generated by the cutting knife falling and cutting will easily shake the semiconductor devices off the rack, which is not conducive to the collection of cut semiconductor devices

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