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Automatic control method for circuit board electroplating

An electronic circuit board, electrolyte technology, applied in the direction of electrodes, electrolysis process, electrolysis components, etc., to achieve the effect of easy operation and mastery, and reduce production costs

Inactive Publication Date: 2018-12-28
NETRON SOFT-TECH ZHUHAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The application is only for the treatment and recycling of waste water

Method used

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  • Automatic control method for circuit board electroplating
  • Automatic control method for circuit board electroplating
  • Automatic control method for circuit board electroplating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Taking copper deposition electroplating, which is common in electroplating of electronic circuit boards, as an example, the precise and automatic control method of copper ion concentration in the electrolyte during electroplating is as follows: 11. The lower end bag is in a flexible anode bag, and is suspended under the anode conductive rod. A micro-pressure detector is installed under the anode conductive rod. When the electrodeposition power supply is connected, the micro-pressure detector detects the pressure value in real time, and will start Pressure value P 0 And the subsequent pressure value Pn (n=1, 2, 3, ...) is transmitted to the signal control and analysis unit. In the production of this embodiment, the electrodeposition time is 5 minutes, and the signal analysis unit calculates that the electrodeposition has been carried out for 30s The subsequent pressure change per unit time ΔP n =Pn -P n-1 , every 10s is an interval, calculated by the signal control ana...

Embodiment 2

[0028] Taking copper deposition electroplating, which is common in electroplating of electronic circuit boards, as an example, the precise and automatic control method of copper ion concentration in the electrolyte during electroplating is as follows: 11. The lower end bag is in a flexible anode bag, and is suspended under the anode conductive rod. A micro-pressure detector is installed under the anode conductive rod. When the electrodeposition power supply is connected, the micro-pressure detector detects the pressure value in real time, and will start Pressure value P 0 And the subsequent pressure value Pn (n=1, 2, 3, ...) is transmitted to the signal control analysis unit. In the production of this embodiment, the electrodeposition time is 20 minutes, and the signal analysis unit calculates that the electrodeposition has been carried out for 1 minute The subsequent pressure change per unit time ΔP n =P n -P n-1 , every 30s is an interval, calculated by the signal control...

Embodiment 3

[0030] Taking copper deposition electroplating, which is common in electroplating of electronic circuit boards, as an example, the precise and automatic control method of copper ion concentration in the electrolyte during electroplating is as follows: 11. The lower end bag is in a flexible anode bag, and is suspended under the anode conductive rod. A micro-pressure detector is installed under the anode conductive rod. When the electrodeposition power supply is connected, the micro-pressure detector detects the pressure value in real time, and will start Pressure value P 0 And the subsequent pressure value Pn (n=1, 2, 3, ...) is transmitted to the signal control analysis unit. In the production of this embodiment, the electrodeposition time is 1h, and the signal analysis unit calculates 1.2 hours from the electrodeposition. The pressure change per unit time ΔP after min n =P n -P n-1 , every 1min is an interval, after calculated by the signal control analysis unit, compared ...

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Abstract

The invention relates to an accurate automatic control method for concentration of metal ions to be deposited in an electrolyte during electronic circuit board electroplating. In the electrodepositionprocess of the circuit board, a soluble anode of the metal to be deposited is placed in an anode bag and hung under an anode conductive rod, a micro-pressure detector is arranged under the anode conductive rod, electrodeposition power supply is switched on, the micro-pressure detector detects a pressure value in real time, and the initial pressure value and the subsequent pressure value are transmitted to a signal control analysis unit, pressure variation within the unit time during (1 / 10-1 / 50)t (t is the expected single-plate electrodeposition time) from beginning of the electrodeposition iscalculated by the signal analysis unit. Through calculation, the pressure variation within the unit time begins to gradually decrease, and the signal analysis unit sends a supplement command to a supplement device. When instantaneous pressure is detected to be equal to initial pressure, the supplement is stopped, so that automatic, accurate and real-time control of the anode metal ion concentration is realized, the quality of circuit board electrodeposition is improved, and the accurate automatic control method is more sensitive and convenient than common solution composition laboratory analysis.

Description

technical field [0001] The invention relates to an automatic control method for circuit board electroplating, in particular to a precise automatic control method for the concentration of metal ions to be deposited in electrolyte solution during electronic circuit board electroplating. Background technique [0002] Electronic circuit boards are used in electronic components to form predetermined circuit connections between electronic components, and play the role of relay transmission, which is a key electronic interconnection of electronic products. With the rapid development of high-tech industries, the design and application of circuit boards are becoming more and more specialized. At the same time, with the development of electronic information industry, the development and application of electronic circuit boards are gradually updated and upgraded. The electrochemical deposition layer is its main preparation. One of the means, among them, the control technology for the e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D21/14C25D17/12C25D7/00
Inventor 李爱芝
Owner NETRON SOFT-TECH ZHUHAI CO LTD
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