Optical cement bonding method and device
A technology of laminating device and optical glue, applied in chemical instruments and methods, lamination devices, layered products, etc., can solve the problems of optical glue overflowing and bubble rebound, and reduce glue overflow, reduce continuous extrusion, The effect of improving product yield and efficiency
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Embodiment 1
[0025] Such as figure 1 As shown, this embodiment provides an optical adhesive bonding method. The optical glue bonding method includes the following steps:
[0026] Provide a substrate to be bonded; arrange the optical glue correspondingly below the substrate to be bonded; provide a roller located under the optical glue, press the optical glue upward through the roller and roll along the optical glue so that the optical glue is bonded to the substrate to be bonded Attached to the substrate.
[0027] The optical glue laminating method provided by the present invention can effectively avoid the glue overflow problem caused by downward pressure lamination in the prior art by using the roller to apply upward pressure to laminate the optical glue on the substrate to be bonded, and effectively reduce the There is a risk of bubble rebound, improve product yield and efficiency, and improve product quality. specifically. In this embodiment, the rolling path of the roller along the...
Embodiment 2
[0031] Such as figure 2 As shown, this embodiment provides an optical glue bonding device for realizing the optical glue bonding method described in the above embodiment, the optical glue bonding device includes a substrate fixing part 1 to be bonded, arranged on the The machine platform 2 below the substrate fixing part 1 to be bonded, the screen plate 3 and the roller 4 which are arranged on the machine platform 2 and correspond to the substrate fixing part 1 to be bonded; the substrate fixing part 1 to be bonded is used for The substrate 100 to be bonded is fixed by vacuum suction, the screen 3 is used to fix the optical glue 200 toward the side of the substrate fixing part 1 to be bonded, and the roller 4 is arranged on the screen 3 facing away from the substrate to be bonded. Substrate fixing part 1 side.
[0032] In this way, the optical adhesive 200 bonding device provided in this embodiment can utilize the substrate fixing part 1 to be bonded by setting the substrate...
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