Reaction chamber and semiconductor processing equipment

Abstract

The invention provides a reaction chamber and semiconductor processing equipment. The reaction chamber includes a cavity. A pedestal used for bearing a to-be-processed workpiece is arranged in the cavity. A process sleeve is arranged above the pedestal. Plasma diffuses to the surface of the to-be-processed workpiece through the process sleeve. Furthermore, the process sleeve includes multiple sub-baffles. The multiple sub-baffles are arranged in order to form a ring. The upper ends of the sub-baffles are rotatably connected to the cavity. The size of a lower opening of the ring is adjusted bychanging inclination angles of the sub-baffles relative to the vertical direction. The reaction chamber provided by the invention can improve the process efficiency, reduce the equipment cost, and improve the flexibility of process result optimization.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a reaction chamber and semiconductor processing equipment. Background technique [0002] In recent years, with the continuous expansion and application of micro-electromechanical device systems in the field of consumer electronics, and the broad prospects of TSV (Throughout Silicon Vias) through-hole etching technology in the future packaging field, the dry plasma deep silicon etching process has gradually become One of the mainstream processes in the field of micro-electromechanical processing and TSV technology, it has a plasma source that generates high-energy plasma, and bombards the wafer under the guidance of the lower bias system, thereby producing a series of physical and chemical effects on the wafer surface. [0003] figure 1 For a cutaway view of an existing reaction chamber, see figure 1 , the reaction chamber 100 includes a cavity, and a base 10...

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Problems solved by technology

[0004] However, the size of the above-mentioned process sleeve is fixed, which makes it necessary to design process sleeves of different sizes for wafers with different diameters, resulting in higher equipment costs, and when processing wafers with different diameters in the same reaction chamber, it is necessary Replacing the process sleeve so that the size of the process sleeve matches the diameter of the wafer affects process efficiency

In addition, in the process of process debugging, the process sleeve with fixed size does not have the process adjustment ability

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