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The Method of Removing Cracks on the Inner Cavity Surface of Selective Laser Melting Formed Parts

A technology of selective laser melting and surface cracking, which is applied to the improvement of process efficiency, additive manufacturing, and energy efficiency. It can solve the problems of complexity, high processing position limitations, and no effect of surface opening cracks, so as to improve surface roughness. , good repeatability and high surface quality results

Active Publication Date: 2020-12-29
AECC COMML AIRCRAFT ENGINE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the inherent characteristics of the hot isostatic pressing process, it can only close the internal cracks of the part and eliminate the internal cracks, but has no effect on the surface opening cracks.
However, the mechanical processing method has problems such as high limitation of processing position and complicated process for parts with complex structures, especially the parts formed by selective laser melting usually have complex inner cavity structures, and the mechanical processing technology is often difficult to play a role

Method used

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  • The Method of Removing Cracks on the Inner Cavity Surface of Selective Laser Melting Formed Parts
  • The Method of Removing Cracks on the Inner Cavity Surface of Selective Laser Melting Formed Parts
  • The Method of Removing Cracks on the Inner Cavity Surface of Selective Laser Melting Formed Parts

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Embodiment Construction

[0024] The technical solutions of the present invention will be described in further detail below with reference to the accompanying drawings and embodiments.

[0025] The specific embodiments of the present invention are for the convenience of further description of the concept of the present invention, the technical problems to be solved, the technical features constituting the technical solution and the technical effects brought about. It should be noted that the description of these embodiments does not constitute a limitation of the present invention. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

[0026] In a schematic embodiment of the method for removing cracks on the surface of the inner cavity of the selected laser melting forming part of the present invention, as figure 1 As shown, the method includes:

[0027] Hot isostatic p...

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Abstract

The invention relates to a method for removing surface cracks in the inner cavity of selected laser melting and forming parts, which comprises: a hot isostatic pressing treatment step: performing hot isostatic pressing treatment on the selected laser melting and forming parts; an abrasive flow treatment step: heat treatment, etc. After the hydrostatic pressure treatment, the selected laser melting and forming parts are subjected to abrasive flow treatment. The method of the present invention for removing surface cracks in the inner cavity of the selected laser melting and forming parts is by setting the abrasive grain flow step after the hot isostatic pressing step, the original surface quality of the selective laser melting and forming parts is better, and the abrasive grain flow process is adopted to eliminate the opening of the inner cavity of the parts Cracks can effectively improve the comprehensive performance of the parts.

Description

technical field [0001] The invention relates to the technical field of material processing, in particular to a method for removing cracks on the inner cavity surface of a part formed by selective laser melting. Background technique [0002] Selective Laser Melting (SLM) technology is a typical additive manufacturing (Additive Manufacturing) technology, which is predicted to be one of the key technologies that may trigger the "third industrial revolution". Its main technical principles are as follows: The three-dimensional digital model of the part to be processed is divided layer by layer, and input into the selected area laser melting forming equipment. First, fix the substrate on the forming platform and level it, then use a scraper or a powder roller to spread powder in a single layer, and use one or more laser beams to melt the laid single-layer powder in selected areas, realizing the point-to-point Line, forming process from line to surface, and then the forming platfo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F3/24B22F3/105
CPCB22F3/24B22F2003/247B22F2003/248B22F10/00B22F10/66B22F10/28B22F10/64B22F3/105Y02P10/25
Inventor 侯慧鹏张渝雷力明何艳丽
Owner AECC COMML AIRCRAFT ENGINE CO LTD
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