Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of manufacturing method and pcb of slot bottom via hole solder resistance plug

A production method and solder mask technology, applied in the directions of printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of uneven force, uneven oil leakage from plug holes, etc., and achieve uniform oil leakage, good alignment, Simple craftsmanship

Active Publication Date: 2020-10-16
DONGGUAN SHENGYI ELECTRONICS
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a method for making a slot bottom via hole solder resist plug hole and a PCB, so as to solve the problem of uneven oil emission from the plug hole in the prior art due to the uneven stress on the bottom of the slot and the outside of the slot.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of manufacturing method and pcb of slot bottom via hole solder resistance plug
  • A kind of manufacturing method and pcb of slot bottom via hole solder resistance plug
  • A kind of manufacturing method and pcb of slot bottom via hole solder resistance plug

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] see figure 1 , the present embodiment 1 provides a method for making a solder resist plug hole in a groove bottom via, which specifically includes the following steps:

[0054]S101. Provide a backing plate and a PCB with stepped grooves.

[0055] S102. Process the backing plate to form a convex groove backing plate, the depth of the convex groove is the depth of the stepped groove, and the position of the convex groove corresponds to the position of the stepped groove, and the convex groove backing plate and the PCB with the stepped groove are fixed together. Drill through holes at positions where solder resist plug holes are required to form a convex groove solder resist plug hole backing plate and a PCB with stepped grooves and through holes.

[0056] It should be noted that the cross section of the convex groove is aligned with the center of the stepped groove of the PCB, and is smaller than or equal to the size of the stepped groove.

[0057] By drilling the holes...

Embodiment 2

[0082] like figure 2 As shown, the manufacturing method of the groove bottom via hole solder resist plug hole provided by the second embodiment of the present invention is based on the technical solution provided by the first embodiment, and the step S102 "processing the backing plate to form a convex groove Backing plate, the depth of the convex groove is the depth of the stepped groove, and the position of the convex groove corresponds to the position of the stepped groove. Fix the convex groove backing plate and the PCB with the stepped groove together, and drill through holes at the positions where solder resist plug holes are required to form Further optimization of a raised slot solder mask plug hole backer and a PCB with stepped slots and through holes". Explanations of terms that are the same as or corresponding to the above embodiments are not repeated here. Specifically include the following steps:

[0083] S201. Provide a backing plate and a PCB with stepped groo...

Embodiment 3

[0105] The third embodiment provides a PCB, which has a slot bottom via hole of a solder resist plug hole, and the slot bottom via hole of the solder resist plug hole is manufactured according to the manufacturing method provided in the above embodiment.

[0106] Compared with the prior art, the PCB provided by the embodiment of the present invention not only solves the problem of uneven stress on the bottom of the groove and outside the groove when the hole is plugged, but also ensures that the plug hole emits oil evenly, and at the same time avoids the use of resin plug holes. The production process is long, the production efficiency is low, and the production cost is high. The production process is simpler, the efficiency is higher, and the alignment is better, which is suitable for mass production.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a manufacturing method and a PCB of a groove bottom through-hole solder resistance plug hole. The method comprises the following steps: providing a pad board and a PCB with a step groove; Machining the backing plate to form a convex groove backing plate, fixing the convex groove backing plate and the PCB with the stepped groove together, drilling through holes at the positions where the solder resistance plug holes are needed to form a convex groove solder resistance plug hole backing plate and a PCB with the stepped groove and the through holes; Metallizing a PCB witha step groove and a through hole to form a via hole; Placing the PCB with the step groove and the through hole on the convex groove solder plug hole pad correspondingly, and the grooved surface of thestep groove faces downward; Solder mask vias from the back of the slotted surface of the stepped slot. Compared with the prior art, the technical proposal provided by the invention not only solves the problem that the force on the bottom of the groove and the outside of the groove is not uniform when the plug hole is inserted, but also ensures that the oil emitting from the plug hole is uniform,the manufacturing process is simpler, the efficiency is higher, the alignment degree is better, and the plug hole is suitable for batch manufacturing.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of printed circuit boards, and in particular to a method for manufacturing slot-bottom via-hole solder-resisting plug holes and a PCB. Background technique [0002] Due to the limitation of the height difference of the stepped grooves, the vias at the bottom of the stepped grooves cannot be plugged from the grooved surface, so the holes must be plugged from the back of the grooved. Plugging the hole from the back of the slot has uneven force inside and outside the slot, which will lead to uneven oil leakage, especially at the bottom of the slot, which is prone to serious oil leakage and pollutes the bottom of the groove; or less oil from the bottom of the groove, resulting in leakage blocked situation. Therefore, it is generally not to make solder resist plug holes at the bottom of the groove, but to replace them with resin plug holes. For stepped grooves, resin plug holes must be made...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/42
CPCH05K3/0047H05K3/0094H05K3/42H05K2201/0959H05K2201/09845H05K2203/0214
Inventor 刘梦茹纪成光魏华
Owner DONGGUAN SHENGYI ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com