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Target material packaging method and packaging tool

A packaging method and target technology, which are applied in the directions of transportation and packaging, packaging, special packaging objects, etc., to achieve the effect of reducing deformation

Active Publication Date: 2018-12-18
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The problem to be solved by the present invention is to provide a target packaging method and packaging tool, which can reduce the deformation of the focus ring during the packaging process

Method used

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  • Target material packaging method and packaging tool
  • Target material packaging method and packaging tool
  • Target material packaging method and packaging tool

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] The existing target packaging method is likely to cause the problem of target deformation.

[0032] The reason for the deformation of the target during the vacuum packaging process is analyzed in combination with the structure of a target:

[0033] figure 1 and figure 2 is a schematic diagram of the structure of a target.

[0034] Please refer to figure 1 and figure 2 , figure 2 yes figure 1 Sectional view along cutting line 1-2. The target 100 includes a sputtering surface and a back surface. The target 100 includes a threaded hole area A, a perforated area B surrounding the threaded hole area A, and a support area C surrounding the perforated area B and the threaded hole area A. ; the groove 110 in the target 100 located in the threaded hole area A and the perforated area B; the first protrusion 111 located on the back of the target 100 in the support area C; part 112, and the second convex part has a threaded hole 121 therein.

[0035] Wherein, the groove...

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Abstract

The invention provides a target material packaging method and packaging tool. A target material comprises a sputtering surface and a groove located in the sputtering surface of the target material. Asfor the packaging method, a protection body and a clamping piece are included; the protection body comprises a contact surface and a center area, and the portion, in the center area, of the contact surface of the protection body is used for being attached to the sputtering surface of the target material; and the clamping piece is located on the portion, in the center area, of the contact surfaceof the protection body and used for being placed in the groove. The sputtering surface of the target material is attached to the contact surface of the protection body, and the protection body can reduce deformation of the target material in the direction perpendicular to the sputtering surface. The clamping piece is arranged in the groove and can support the portions, on the two sides of the groove, of the target material so that the target material can be prevented from deforming in the direction parallel to the sputtering surface. Thus, deformation of the target material can be reduced by means of the target material packaging method.

Description

technical field [0001] The invention relates to the field of manufacturing semiconductor sputtering targets, in particular to a target packaging method and a packaging tool. Background technique [0002] Sputtering technology is a basic coating technology, which refers to bombarding the solid surface with particles (ions or neutral atoms, molecules) of a certain energy, so that the atoms or molecules near the surface of the solid can obtain enough energy to escape from the solid surface and reach Substrate process. [0003] The target is a sputtering source that forms various functional thin films on the substrate by sputtering under appropriate process conditions through magnetron sputtering, multi-arc ion plating or other types of coating systems. Simply put, the target is the target material bombarded by high-speed energetic particles. Different film systems (such as superhard, wear-resistant, anti-corrosion alloy films, etc.) can be obtained by replacing different targ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D81/20B65D59/00
CPCB65D59/00B65D81/2007
Inventor 姚力军潘杰相原俊夫王学泽罗明浩阮力超
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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