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Electronic chip multi-station intelligent transmission discharge robot

An electronic chip and multi-station technology, applied in packaging and other directions, can solve problems such as low transmission efficiency, shaking of IC chips, inaccurate position, etc., and achieve high transmission efficiency, increased working precision, and accurate position

Active Publication Date: 2018-12-18
ZHEJIANG GUANGYUE ENVIRONMENTAL POLYTRON TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the above problems, the present invention provides a multi-station intelligent transmission and discharge robot for electronic chips, which can solve the problems of low transmission efficiency of IC chips, inability to automatically correct the polarity of IC chips, etc. The position of the IC chip is not accurate when it is loaded into the tray, and the IC chip in the tray will shake when the tray is moved; it can realize the function of absorbing and transferring the IC chip and automatically correcting its polarity, and has the function of transferring High efficiency, automatic correction of the polarity of the IC chip, accurate position of the IC chip when loaded into the tray, no shaking of the IC chip in the tray when the tray is moving, etc.

Method used

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  • Electronic chip multi-station intelligent transmission discharge robot

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Embodiment Construction

[0029] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific illustrations. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0030] Such as Figure 9 As shown, the commonly used IC chip tray has a rectangular structure, and a protrusion is provided at the left and right ends of the tray.

[0031] Such as Figure 1 to Figure 8 As shown, a multi-station intelligent transmission and discharge robot for electronic chips includes a support base plate 1, a conveyor belt 2, a suction device 3 and a stacking device 4, and a conveyor belt 2 is installed on the top of the left end of the support base plate 1. The top of the right end is provided with a chute, the stacking device 4 is installed on the top of the rig...

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Abstract

The invention relates to an electronic chip multi-station intelligent transmission discharge robot. The electronic chip multi-station intelligent transmission discharge robot comprises a supporting bottom plate, a conveyor belt, a suction device and a stacking device. The conveyor belt is installed at the top of the left end of the supporting bottom plate, a sliding groove is formed in the top ofthe right end of the supporting bottom plate, the stacking device is installed at the top of the right end of the supporting bottom plate, and the suction device is installed at the top of the outer end of the supporting bottom plate. The stacking device comprises a placement supporting plate, a placement sliding rod, a placement pushing rod, a pushing rod connecting plate, a sliding supporting frame, a bearing mechanism, a gear, a gear motor, a gear rotating shaft and a gear connecting plate. The electronic chip multi-station intelligent transmission discharge robot can solve the problems that existing IC chips is low in transmission efficiency during packaging, the polarity of the IC chips cannot be automatically corrected, the positions of the IC chips is inaccurate when the IC chips are loaded into a tray and the IC chips in the tray are prone to shaking when the tray moves.

Description

technical field [0001] The invention relates to the technical field of electronic product processing, in particular to a multi-station intelligent transmission and discharge robot for electronic chips. Background technique [0002] An IC chip is an IC chip made by placing an integrated circuit formed by a large number of microelectronic components on a plastic base; the IC chip needs to be packaged after processing and testing, and part of the IC chip is packed in a roll In the tape, most of the IC chips are installed in the tray, especially the square IC chip. This IC chip has a square structure and has pins installed on the four sides. It is necessary to adjust the polarity of the IC chip, such as Figure 9 As shown, the commonly used IC chip tray has a rectangular structure, and there is a protrusion at the left and right ends of the tray. Now some small IC chip processing factories generally use semi-automatic methods for packaging square IC chips. After processing, it ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65B35/38B65B43/54B65B35/58
CPCB65B35/38B65B35/58B65B43/54
Inventor 彭婷
Owner ZHEJIANG GUANGYUE ENVIRONMENTAL POLYTRON TECH INC
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