Low-temperature and high-adhesion conductive silver paste

Abstract

The invention discloses a low-temperature and high-adhesion conductive silver paste which is composed of the following components in parts by weight: conductive fillers, polyurethane resin, glyceryl ether epoxy resin, polyether, hydrogenated castor oil, dicyandiamide, hexahydrophthalic anhydride, N, N-dipropyl-1-propylamine, neopentyl glycol glycidyl ether, Gamma-aminopropyltriethoxysilane, a defoaming agent, methylisobutylketone and cyclohexanone, wherein the conductive fillers are mixtures formed by mixing a silver powder with silver nanowires at a weight ratio of 100 to 25-40; the silver powder has a diameter of 2-8 Mum; the silver nanowires have a length of 20-200 Mum and the diameter of 20-100 nm. The low-temperature and high-adhesion conductive silver paste provided by the inventioncan be stored for 12 months at an ambient temperature below 15 DEG C, has good storage stability, and can be dried and cured in 100 seconds at 120 DEG C, thereby improving the production efficiency and the yield.

Description

technical field [0001] The invention relates to the field of conductive silver paste, in particular to a low-temperature high-adhesion conductive silver paste. Background technique [0002] Conductive silver glue has been widely used in the electronics industry, mainly for bonding conductive objects between different materials. At present, most of the conductive silver adhesives on the market are two-component systems that use epoxy resin as the base resin and different types of amino resins as the curing agent, and use ultra-fine silver powder as the conductive medium. Between 60% and 70%, the cost is also relatively high. This type of silver glue still has two major defects. One is that it requires strict storage conditions, poor stability, and a short shelf life; the other is that the curing temperature is high and the time is long. It takes 20-30 minutes or longer to cure at 150°C, which is not conducive to the improvement of production efficiency; therefore, how to ove...

AI Technical Summary

Problems solved by technology

At present, most of the conductive silver adhesives on the market are two-component systems that use epoxy resin as the base resin and different types of amino resins as the curing agent, and use ultra-fine silver powder as the conductive medium. Between 60% and 70%, the cost is also relatively high. This type of silver glue still has two major defects. One is that it requires strict storage conditions, poor stability, and a short shelf life; the other is that the curing temperature is high and the time is long. It takes 20-30 minutes or longer to cure at 150°C, which is not conducive to the improvement of production efficiency; therefore, how to overcome the above technical problems has become the direction of efforts of ordinary skilled in the art