Method for preventing solder mask ink from plugging hole, printed circuit board and computer device

Abstract

The invention provides a method for preventing solder mask ink from plugging a hole, a printed circuit board, a computer device and a computer readable storage medium. The method for preventing the solder mask ink from plugging the hole comprises the following steps: a solder mask non-plugging hole of the printed circuit board is subjected to hole sealing operation; solder masking operation is performed on the printed circuit board; the solder mask non-plugging hole of the printed circuit board is subjected to hole opening operation. The method disclosed in the present invention can help prevent the non-plugging hole from being plugged by ink, the method can help prevent a problem of printed circuit board and blocking point net expansion and shrinkage that occurs when block point net ink is used and a problem of alignment precision, scrapping of the printed circuit board which is caused when the hole is plugged by ink can be reduced, and high reliability and high efficiency can be realized.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for preventing holes blocked by solder resist ink, a printed circuit board, a computer device and a computer-readable storage medium. Background technique [0002] With the increasing application of printed circuit boards, the requirements for corresponding circuit boards have also changed. In the case of through-hole solder masking, there are requirements for making plugged holes, non-plugged holes, oil-covered holes, and window openings at the same time. Due to the limitation of the production process, the phenomenon of non-plugging ink blocking the hole occurs. The traditional production method is to use the dot screen printing oil, but this method cannot be completely eliminated due to the limitation of the expansion and contraction of the printed circuit board and the dot network and the alignment accuracy. Hole blocking phenomenon, especially for pla...

AI Technical Summary

Problems solved by technology

[0002] With the increasing application of printed circuit boards, the requirements for corresponding circuit boards have also changed. In the case of through-hole solder masking, there are requirements for making plugged holes, non-plugged holes, oil-covered holes, and window openings at the same time. Due to the limitation of the production process, the phenomenon of non-plugging ink blocking the hole occurs. The traditional production method is to use the dot screen printing oil, but this method cannot be completely eliminated due to the limitation of the expansion and contraction of the printed circuit board and the dot network and the alignment accuracy. Hole blocking phenomenon, especially for plates with small holes and high thickness-to-diameter ratio.

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