A liquid cooling device for automatic heat dissipation

Abstract

The invention discloses a liquid cooling apparatus with an automatic heat dissipation function. The liquid cooling apparatus comprises an apparatus to be heat dissipated, a heat exchanging apparatus mounted on the apparatus to be heat dissipated, a heat dissipation apparatus, a pump, a first liquid storage tank and a plurality of communicating pipes, wherein the communicating pipes comprise a first communicating pipe, a second communicating pipe, a third communicating pipe, a fourth communicating pipe, a fifth communicating pipe and a sixth communicating pipe. The first liquid storage tank iscommunicated with the pump and the heat dissipation apparatus through the first communicating pipe and the fourth communicating pipe respectively, the heat exchanging apparatus is communicated with the pump and the heat dissipation apparatus through the second communicating pipe and the third communicating pipe respectively. A second liquid storage tank is further arranged in the liquid cooling apparatus, and the heat exchanging apparatus is communicated with the second liquid storage tank through the fifth communicating pipe and the sixth communicating pipe respectively. According to the liquid cooling apparatus with the automatic heat dissipation function, it is simple in structure and convenient to operate, the heat dissipation apparatus and the heat exchanging apparatus are designed creatively, so that cooling efficiency of the liquid cooling apparatus is greatly improved, cooling capacity of the liquid cooling apparatus is enhanced, and the liquid cooling apparatus is effective and practical.

Description

technical field [0001] The invention relates to the technical field of liquid cooling, in particular to a liquid cooling device for automatic heat dissipation. Background technique [0002] A liquid cooling system, also known as a water cooling system, is a system that uses the circulating flow of coolant to remove excess heat from the engine, thereby avoiding overheating. With the advancement and development of science and technology, some high-power devices are used more and more frequently. Long-term use will increase the overall power consumption and heat generation of the device, causing its temperature to rise continuously. If it is not dissipated in time, these high-power Devices tend to fail or be damaged due to high temperatures. [0003] Nowadays, the most widely used heat dissipation method is liquid cooling technology, which can use components such as radiators and heat exchangers to realize the circulation of coolant through pipes, so as to reduce the temperatu...

AI Technical Summary

Problems solved by technology

With the advancement and development of science and technology, some high-power devices are used more and more frequently. Long-term use will increase the overall power consumption and heat generation of the device, causing its temperature to rise continuously. If it is not dissipated in time, these high-power Devices tend to fail or be damaged by high temperature

[0003] Nowadays, the most widely used heat dissipation method is liquid cooling technology, which can use components such as radiators and heat exchangers to realize the circulation of coolant through pipes, so as to reduce the temperature of high-power devices. Most of the devices are not easy to disassemble and replace, and the cooling speed is relatively slow

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