Flexible hinge micro-component bending testing device with large measuring range and high accuracy

Abstract

The invention provides a flexible hinge micro-component bending testing device with a large measuring range and high accuracy. A loading mechanism is characterized in that initial displacement is output through a linear motor and is reduced by a first-level displacement reduction mechanism to be output as first-level displacement; a second-level displacement amplification mechanism is characterized in that the displacement is generated through a first piezoelectric ceramic driver and is amplified and output as second-level displacement, and the first-level displacement and the second-level displacement are taken as final displacement; a tool bit takes the final displacement as a displacement amount which moves forwards towards a test piece, force borne when the tool bit moves forwards is measured through a pressure sensing mechanism, and a tool bit advancing displacement amount is read through an optical grating displacement sensing mechanism; the clamping body of a clamping mechanismis characterized in that the displacement generated by a second piezoelectric ceramic driver is output after being amplified, and is transferred to one pair of clamping heads of the output end of theclamping body to form the clamping of the test piece. According to the flexible hinge micro-component bending testing device, the micro-nano-level accurate loading of micro-force micro displacement can be realized, and good guidance quality in a clamping and bending process is guaranteed so as to adapt to the micro-component mechanical property testing of various materials.

Description

technical field [0001] The invention relates to a mechanical performance testing device for micro-nano materials in the technical field of thin film materials, more specifically, a flexible hinge micro-component bending testing device with a large range and high precision. Background technique [0002] With the rapid development of micro-electromechanical systems (MEMS) technology, micro-components of various materials are widely used in micro-devices. The size of MEMS micro-components generally ranges from millimeters to microns. Due to factors such as processing technology, size effects, and surface defects, the mechanical properties of materials at the micro-scale and those at the macro-scale may vary greatly. Therefore, the mechanical properties of micro-components are an important theoretical basis for the study of MEMS, and are very important for the reliability design of MEMS devices. Unidirectional bending test is the most direct method to measure parameters such as...

AI Technical Summary

Problems solved by technology

For this reason, the present invention proposes an easy-to-operate, low-cost flexible hinge micro-component bending test device with a large range and high precision, in order to overcome the measurement error caused by the low guiding precision in the existing measurement method and the comparison of the non-contact measurement mechanics. Few deficiencies, realize micro-nano-level precise loading of micro-force and micro-displacement, ensure good guidance in the process of clamping and bending, so as to adapt to the mechanical performance test of micro-components of various materials

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