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Device for adhering adhesive tape in CIGS glass substrate wiring hole

A technology for glass substrate and adhesive tape, applied in the field of machinery, can solve the problems of difficulty in manual cutting of adhesive tape, low precision of pasting position, and inability to meet on-site production in work efficiency.

Pending Publication Date: 2018-11-16
CNBM TRIUMPH ROBOTICS SHANGHAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are some deficiencies in using manual methods. The main disadvantages are as follows: (1) It is difficult to cut the tape manually; (2) The accuracy of the sticking position is not high; (3) The work efficiency cannot meet the needs of on-site production

Method used

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  • Device for adhering adhesive tape in CIGS glass substrate wiring hole
  • Device for adhering adhesive tape in CIGS glass substrate wiring hole
  • Device for adhering adhesive tape in CIGS glass substrate wiring hole

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Embodiment Construction

[0080] In order to describe the technical content of the present invention more clearly, further description will be given below in conjunction with specific embodiments.

[0081] It should be noted that when an element is referred to as being "fixed" or "connected" to another element, it may be directly or indirectly on the other element. As used herein, the terms "horizontal", "upper", "lower", "left", "right" and similar expressions are for the purpose of illustration only and are not intended to represent the only embodiments. The "first", "second" and the like mentioned in the present invention are only used to distinguish names, and do not represent specific actual numbers or sequences. For the convenience of description, the products targeted by this equipment are collectively referred to as "glass substrates".

[0082] The invention discloses a device for adhering a tape to a CIGS glass substrate wiring hole, wherein the device includes:

[0083] Transport and positi...

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Abstract

The invention relates to a device for adhering adhesive tape in a CIGS glass substrate wiring hole. The device comprises a conveying positioning module, an adhesive tape cutting and adhering module, apositioning and guiding module and an adhesive tape press-fit module; due to the cooperative work of the modules, the process requirement of full-automatic production from feeding, cutting and adhering to discharging is met; meanwhile, while the automatic cutting action on the adhesive tape is completed, automatic adhering of the adhesive tape is achieved through a downward pressing mechanism; acylinder output speed and pressure are convenient to adjust, and a downward pressing protecting mechanism is used for protecting glass; and compared with manual work, the takt is fast and stable in the whole process. The device adopting the structure can achieve automatic adhering operation of the adhesive tape in the CIGS glass substrate wiring hole, and can be applied to adhesive tape in variouswidths, the cutting length can be adjusted within a certain range, and the requirements of different processes can be met.

Description

technical field [0001] The invention relates to the field of machinery, in particular to the field of sticking CIGS glass substrate wiring holes with adhesive tape, and specifically refers to a device for sticking adhesive tape to CIGS glass substrate wiring holes. Background technique [0002] New energy has been generally recognized as the future direction of energy development. As an important part of new energy, solar energy has been greatly developed and widely used after decades of research and utilization. At present, the development of solar cells has entered the era of thin-film solar cells as the core technology, and copper indium gallium selenium thin-film solar cells (CIGS, CIGS is the abbreviation of solar thin-film cells CuInxGa(1-x)Se2) was developed in the late 1980s. A new type of solar cell developed on the basis of CIGS cells has become one of the research hotspots in the global photovoltaic field due to its superior comprehensive performance, and some pro...

Claims

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Application Information

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IPC IPC(8): B65H37/04B65H35/06
CPCB65H35/0033B65H37/04
Inventor 高雪嵩杨海明陈坤黄祥陆定军
Owner CNBM TRIUMPH ROBOTICS SHANGHAI CO LTD
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