Mechanical chuck and semiconductor processing equipment

Abstract

The invention provides a mechanical chuck and semiconductor processing equipment. The mechanical chuck includes a pedestal, a sputtering ring and a snap ring. The top surface of the pedestal is used for bearing a to-be-processed member. The sputtering ring sleeves the outside of the top part of the pedestal. The snap ring includes a first snap ring component and a second snap ring component whichare arranged in an inside and outside nesting manner, wherein the first snap ring component is arranged on the outer side and the second snap ring component is arranged on the inner side. The first snap ring component and the second snap ring component are superimposed on the upper surface of the sputtering ring. The second snap ring component laminates the edge area of the to-be-processed memberso as to fix the to-be-processed member to the top surface of the pedestal. The mechanical chuck is high in switching efficiency and can prevent the to-be-processed member from being crushed.

Description

technical field [0001] The invention belongs to the field of semiconductor manufacturing, and in particular relates to a mechanical chuck and a semiconductor processing device. Background technique [0002] During the manufacturing process of integrated circuits, physical vapor deposition (Physical Vapor Deposition, hereinafter referred to as PVD) technology is usually used to deposit metal materials on the surface of the wafer. With the maturity and wide application of Through Silicon Via (TSV) technology, PVD technology is applied to deposit a barrier layer and a copper seed layer inside the Silicon Via. [0003] In PVD equipment, electrostatic chucks and mechanical chucks are two common methods used to hold wafers. The electrostatic chuck uses electrostatic attraction to fix the wafer. However, when the deposition process of through-silicon vias is implemented, due to the large thickness and stress of the film deposited in the through-silicon vias, the electrostatic chuc...

AI Technical Summary

Problems solved by technology

[0005] In practical applications, in order to improve the efficiency of PVD equipment, the same PVD equipment is often used to process wafers of different sizes (such as 12-inch wafers and 8-inch wafers). 3 and the size of the sputtering ring 5 are different, that is, the machines corresponding to processing wafers of different sizes are not compatible

Therefore, when processing wafers of different sizes, it is necessary to replace the matching machine, that is, the inner shield 2, the snap ring 3 and the sputtering ring 5 need to be replaced. Use efficiency and processing efficiency

[0006] In addition, when using the machine for processing 12-inch wafers to process 8-inch wafers, the outer diameter of the snap ring 3 corresponding to the 8-inch wafers needs to be enlarged to match the size of the inner shield 2 corresponding to the 12-inch wafers, which will inevitably increase Due to the weight of the snap ring 3, it is easy to crush the wafer due to the heavy weight of the snap ring 3

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