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Ultrafast ultraviolet laser processing method and device of transparent material

A transparent material and ultraviolet laser technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of limited processing and achieve the effect of improving removal efficiency

Pending Publication Date: 2018-11-13
杭州银湖激光科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] The purpose of the present invention is to provide a processing method for ultra-fast ultraviolet laser transparent materials, to overcome the problem of limited processing in the prior art, and to improve the precision and speed of laser transparent material processing

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  • Ultrafast ultraviolet laser processing method and device of transparent material
  • Ultrafast ultraviolet laser processing method and device of transparent material
  • Ultrafast ultraviolet laser processing method and device of transparent material

Examples

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Embodiment 1

[0040] Embodiment one: see figure 2 As shown, a processing device for transparent materials is composed of an ultrafast ultraviolet pulse train laser, a scanning galvanometer, and a focusing lens. See figure 1 , the ultraviolet ultrafast burst laser is mainly composed of a burst seed laser with an output wavelength between 1020 nanometers and 1090 nanometers, a multi-stage or single-stage fiber amplifier, a collimator, and a frequency tripler device. The burst seed laser After the output light is amplified by the fiber amplifier, it is collimated by the collimator to output the laser pulse train; the optical triple frequency is performed to obtain the ultraviolet output with a wavelength of 510nm-545nm, and the ultraviolet laser pulse train is output. The laser pulse train is focused on the position of the transparent material to be processed by the focusing lens after passing through the scanning galvanometer. The ultraviolet ultrafast pulse train laser and the scanning gal...

Embodiment 2

[0042] Embodiment two: see attached image 3 As shown, a transparent material processing device is composed of an ultrafast pulse train laser and a focusing lens, see figure 1 , the ultrafast burst laser is mainly composed of an ultrafast burst seed laser with an output wavelength between 1020 nanometers and 1090 nanometers, a multi-stage or single-stage fiber amplifier, a collimator and a frequency tripler device, and the burst seed laser After the output light is amplified by the fiber amplifier, the laser pulse train is output after being collimated by the collimator; the optical triple frequency is performed to obtain the ultraviolet output with a wavelength of 510nm-545nm, and the ultraviolet laser pulse train is output. The laser pulse train is focused by the focusing lens on the position of the transparent material to be processed. Below the transparent material, corresponding to the position to be processed, there is a dust suction device for recycling the removed mat...

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Abstract

The invention discloses an ultrafast ultraviolet laser processing method and device of a transparent material, and provides an optical fiber laser of which the wave length is 1020 nm to 1090 nm. The processing method is characterized in that energy amplification is carried out through an optical fiber amplifier; optical third harmonic generation is carried out, and ultraviolet laser pulse trains are acquired; each pulse train comprises at least two laser pulses, pulse width is smaller than 200 ps, peak power of the pulses is larger than 50 kW, the time between the adjacent laser pulses in thepulse trains is smaller than 90 ns, the interval among the pulse trains is larger than 240 ns, and the total pulse number in each second is larger than 50000; ultrafast laser beams output by the laserare subjected to energy amplification only through the optical fiber amplifier; and the ultraviolet laser beams are focused on the lower surface of the to-be-processed transparent material, processing is carried out according to a set track, a focus point is gradually risen, and the transparent material is processed from bottom to up. According to the processing method, material removal efficiency can be greatly improved, a heating or etching follow-up procedure is not required, and bevel angles are avoided.

Description

technical field [0001] The invention relates to a transparent material processing method, in particular to an ultrafast laser processing method for transparent materials. Background technique [0002] Glass and sapphire transparent materials have become an indispensable part of people's daily life. With the development of economy, the demand for glass products is increasing day by day. In the glass and sapphire production industry, glass and sapphire processing is a very important link. [0003] Generally speaking, glass and sapphire processing (cold processing) mainly includes polishing, cutting, drilling, engraving, edging, etc. In order to industrialize the above-mentioned glass and sapphire processing purposes, the processing methods used in the prior art mainly include mechanical processing methods, chemical processing methods (mainly used for polishing and etching), high-pressure water jet processing methods (mainly used for cutting and drilling) holes) and laser pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/06B23K26/064B23K26/36B23K26/402
CPCB23K26/06B23K26/0648B23K26/36B23K26/402
Inventor 蒋仕彬
Owner 杭州银湖激光科技有限公司
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