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A heat-dissipating driving bottom plate combination mechanism

A bottom plate combination and heat dissipation technology, which is applied in the direction of support structure installation, installation board safety device, electrical equipment structural parts, etc., can solve the problems of inconvenient disassembly, installation of PCB board, poor heat dissipation effect, one-sided heat dissipation, etc., to achieve The structure is novel, easy to disassemble, and the effect of ensuring heat dissipation efficiency

Active Publication Date: 2020-02-21
ANHUI JIETAI INTELLIGENT TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the disadvantages of poor heat dissipation, one-sided heat dissipation, and inconvenient disassembly and installation of PCB boards in the prior art, and propose a heat dissipation type drive base plate combination mechanism

Method used

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  • A heat-dissipating driving bottom plate combination mechanism
  • A heat-dissipating driving bottom plate combination mechanism
  • A heat-dissipating driving bottom plate combination mechanism

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Embodiment Construction

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0019] refer to Figure 1-3 , a heat-dissipating type driving bottom plate combination mechanism, comprising a bottom plate 1, a horizontal plate 2, a heat dissipation plate 3, an installation fixing plate 4 and a PCB board 5, the top and the periphery of the bottom plate 1 are fixedly connected with vertical connecting plates 10, and the connecting plates 10 A horizontal plate 2 is fixedly connected to the inner wall of the base plate, the base plate 1, the connecting plate 10 and the horizontal plate 2 are integrally formed, the heat dissipation plate 3 is seamlessly welded to the horizontal plate 2 and the fixed plate 4 respectively, and the horizontal plate 2, the...

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Abstract

A heat dissipation type driving bottom plate combination mechanism includes a bottom plate, a horizontal plate, a heat dissipation plate, an installing fixing plate and a PCB board. The top edge of the bottom plate is fixedly connected with a vertical connecting plate, a plurality of heat dissipation holes are arranged in the heat dissipation plate, a blower is fixedly connected with a symmetricalcorner of the mounting fixation plate, a PCB board is fixedly connected with threads on the mounting fixation plate, and a heat dissipation fin is fixedly connected with the bottom end of the heat conduction plate. The heat dissipation type driving bottom plate combination mechanism of the invention has a novel structure and can realize the heat dissipation of electronic components on the PCB board and the heat dissipation of soldering lines on the PCB board to ensure the heat dissipation efficiency of the PCB board. The invention utilizes two kinds of heat dissipation ways to improve the heat dissipation effect of the device. One is to realize air convection between the hot gas in the heat dissipation chamber and the outside air for heat exchange. Secondly, heat transfer and dissipationusing a heat conduction plate and heat dissipation fins are utilized.

Description

technical field [0001] The invention relates to the technical field of driving bottom plate combination mechanism, in particular to a heat dissipation type driving bottom plate combination mechanism. Background technique [0002] The driving bottom plate is to fix the support plate of the PCB board. When the existing PCB board is installed, the heat dissipation of the PCB board needs to be considered. The existing PCB board heat dissipation device is either a heat dissipation electronic component or a soldering end of the heat dissipation PCB board. Therefore To a large extent, the overall heat dissipation effect of the PCB board cannot be guaranteed, which in turn affects the service life of the PCB board. It is inconvenient to install and disassemble the PCB board, and affects the maintenance efficiency of the PCB board. Contents of the invention [0003] The purpose of the present invention is to solve the disadvantages of poor heat dissipation effect, one-sided heat di...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H05K7/14
CPCH05K7/1417H05K7/20136H05K7/205
Inventor 汪加泰陈迎宾吕毓鑫
Owner ANHUI JIETAI INTELLIGENT TECH
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