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A semiconductor chip production process

A production process and semiconductor technology, applied in the manufacture of semiconductor/solid-state devices, electrical components, circuits, etc., which can solve the problems of weakened adsorption force, inability to adjust the size of adsorption pore size, and clogging of adsorption pores.

Active Publication Date: 2020-06-02
广东可易亚半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] When the cutting process of this technical solution is used to cut the wafer, the size of the adsorption aperture cannot be adjusted, so that it cannot cut wafers of different sizes. weaken

Method used

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  • A semiconductor chip production process
  • A semiconductor chip production process
  • A semiconductor chip production process

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Experimental program
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Embodiment approach

[0039] As an embodiment of the present invention, one side of the adsorption hole 5 is provided with a communication hole 51; one end of the communication hole 51 communicates with the adsorption hole 5; the other end of the communication hole 51 communicates with the outside world; the communication hole 51 A dredging block 52 is slidingly installed inside; the dredging block 52 is provided with a No. 1 through hole 53 in the same direction as the adsorption hole 5 , and the dredging block 52 is used to prevent the adsorption hole 5 from being blocked. When working, after the adsorption hole 5 absorbs the wafer, the communication hole 51 is always connected with the outside world. When the suction hole 5 is vacuumed, the external air pressure pushes the dredging block 52 to move into the adsorption hole 5. After the wafer cutting is completed, the dredging The block 52 returns under the action of the spring, so as to alleviate the blockage of the cutting dust to the adsorption...

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Abstract

The invention belongs to the technical field of semiconductor production, in particular to a semiconductor chip production process. The process adopts a scriber comprising a workbench, a suction cup,a vacuum generator and a cutting knife. A vacuum generator is arranged in the workbench. A suction cup is mounted on the workbench; the suction cup is used for adsorbing a wafer; a cutting knife is arranged above the suction cup; and an adjusting device is also included; the adjusting device is installed on the adsorption hole of the suction cup, and is used for adjusting the adsorption area of the adsorption hole. The invention adjusts the size of the adsorption hole by setting the adjusting device, so as to avoid insufficient adsorption force caused by too small adsorption hole, causing cutting damage and affecting the quality of the wafer. As a communication hole is arranged in one side of the adsorption hole, a dredging block is slidably installed in the communication hole, after the adsorption hole is vacuumized, the dredging block is driven to move toward the adsorption hole by the external air pressure, and after the wafer is cut, the dredging block recovers under the action ofa spring, thereby alleviating the blockage of the adsorption hole by the cutting powder chips.

Description

technical field [0001] The invention belongs to the technical field of semiconductor production, in particular to a semiconductor chip production process. Background technique [0002] In the semiconductor chip production process, when the wafer is diced by the traditional dicing process, the wafer needs to be fixed on the suction cup during dicing. A suction groove is processed on the surface of the suction cup, and the wafer is adsorbed on the surface of the suction cup by generating a low-pressure vacuum in the suction groove. Due to the high-speed rotation of the spindle during the scribing process, the blade generates a large cutting force when scribing the wafer, so the adsorption of the wafer needs to be very stable and reliable. However, the existing suction cups have the problem of poor adsorption stability. [0003] The size of the adsorption force of the suction cup will directly affect the stability of the vacuum adsorption, and the size of the adsorption force...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683H01L21/67
CPCH01L21/67011H01L21/6838
Inventor 赵喜高李涵潘万胜
Owner 广东可易亚半导体科技有限公司
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