Heat radiation device, manufacturing method of heat radiation device and server
A heat dissipation device and server technology, which can be used in cooling/ventilation/heating transformation, instruments, electrical equipment structural parts, etc., can solve the problem of low heat dissipation efficiency of sealed chips, and achieve the effect of reducing the transmission path
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0058] In order to make the purpose, technical solution and advantages of the present application clearer, the implementation manners of the present application will be further described in detail below in conjunction with the accompanying drawings.
[0059] At present, multiple chips are generally packaged on the packaged chip, and the multiple chips include the main chip and other chips, and the thickness of the multiple chips is the same, wherein the heating power of the main chip is greater than that of other chips, for example: the The main chip can be a processor chip such as CPU or GPU on the packaged chip, and other chips can be HBM chips or other chips with less power consumption except the GPU on the packaged chip. In the related art, a heat dissipation device can be used to dissipate heat from the packaged chip. The heat dissipation device includes a heat dissipation substrate and a plurality of heat dissipation fins evenly arranged on the heat dissipation substrate....
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com