Test system and method for determination of visible light light-cured resin full-field strain

Abstract

The present invention relates to a test system for determination of visible light light-cured resin full-field strain. The system comprises an image generation module, an image collection module and an image analysis module; the image generation module comprises visual light, a support and a digital micro-mirror chip, a planar reflector, a focusing lens and a resin slide which are installed on thesupport in order from bottom to top, and the visual light horizontally illuminates the planar reflector; the image collection module comprises a support rack, an industrial camera clamping device installed on the support rack and an industrial camera clamped on the industrial camera clamping device; and the image analysis module is a computer based on Ncorr software, wherein the industrial camerais located above the resin slide, and the digital micro-mirror chip is electrically connected with the computer. The test system is simple in structure, and can accurately achieve non-contact measurement of the full-field strain of the light-cured resin in the light curing process in real time. The present invention further provides a test system for determination of visible light light-cured resin full-field strain, belonging to the technical field of test measurement material parameters.

Description

technical field [0001] The invention relates to the technical field of testing and measuring material parameters, and relates to a testing system and method for determining the full-field strain of a visible light-curable resin. Background technique [0002] Photosensitive resins are composed of polymer monomers and prepolymers, in which photoinitiators are added. Under the irradiation of light of a certain wavelength, the polymerization reaction is caused immediately, and the curing is completed. Photosensitive resin is generally liquid and can be used to make high-strength, high-temperature-resistant, waterproof and other materials. It conforms to the material characteristics required by SLA technology. According to its process principle and the use requirements of prototype parts, it has the performance characteristics of low viscosity, fast leveling, fast curing speed, small shrinkage, small swelling, and no toxic side effects. Therefore, photosensitive resin is being ...

AI Technical Summary

Problems solved by technology

Compared with the traditional strain gauge measurement method, this method has greatly improved the accuracy, but there are huge difficulties in the experimental operation, mainly because it is difficult to measure the motion of the particles, and professional and expensive instruments are needed to realize the particle motion. accurate measurement

With the maturity of the DIC method, the use of the DIC method to measure the polymerization shrinkage strain during the curing process of the photosensitive resin is becoming more and more extensive. Some scholars have also proposed similar devices to measure the shrinkage and warpage during the resin curing process, but these devices are basically Both use a light source and a reverse shutter device of the camera, that is, light curing and image acquisition are carried out step by step, and real-time image acquisition cannot be achieved

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